Inventor · disambiguated record
Chan Goo Yoo
Also filed as: YOO CHAN · YOO CHAN GOO
0 granted patents·3 pending applications·0 citations·filing 2016–2018
Top patents by PatentIndex Score
3 records- 0136US2020075548A1Interconnects for a multi-die packageMICRON TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 0235US2016244891A1Solder ball for fluxless bonding, method of manufacturing the same, and method of forming solder bumpMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
- 0326US2016315040A1Core for reverse reflow, semiconductor package, and method of fabricating semiconductor packageMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →