Inventor · disambiguated record
Chan H. Yoo
Also filed as: YOO CHAN · YOO CHAN H · YOO CHAN-HYUNG
72 granted patents·17 pending applications·192 citations·filing 1992–2025
98Inventor score
Files withMICRON TECHNOLOGY INC74LODESTAR LICENSING GROUP LLC5KOREA ELECTRONICS TELECOMM4INTEL CORP2SEOUL NAT UNIV R&DB FOUNDATION2
Top patents by PatentIndex Score
89 records- 0198US11868253B2Memory device interface and methodLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Jan 9, 2024·3 cites·20 claims
- 0298US11574820B2Semiconductor devices with flexible reinforcement structureMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 7, 2023·4 cites·20 claims
- 0398US11386004B2Memory device interface and methodMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 12, 2022·12 cites·20 claims
- 0497US11824010B2Interposers for microelectronic devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 21, 2023·3 cites·20 claims
- 0595US10872835B1Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 22, 2020·8 cites·20 claims
- 0694US11037910B2Semiconductor device having laterally offset stacked semiconductor diesMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 15, 2021·4 cites·19 claims
- 0793US10103038B1Thrumold post package with reverse build up hybrid additive structureMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 16, 2018·11 cites·25 claims
- 0893US2025391670A1Semiconductor devices with flexible reinforcement structureMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0990US10304805B2Dual sided fan-out package having low warpage across all temperaturesMICRON TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·5 cites·18 claims
- 1088US12400877B2Semiconductor devices with flexible reinforcement structureMICRON TECHNOLOGY INC·Filed 2024·Granted Aug 26, 2025·0 cites·20 claims
- 1188US11791315B2Semiconductor assemblies including thermal circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 17, 2023·1 cites·20 claims
- 1288US11171118B2Semiconductor assemblies including thermal circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 9, 2021·4 cites·21 claims
- 1387US10840229B2Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposerMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·3 cites·16 claims
- 1485US12253943B2Memory device interface and methodLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 1585US11664291B2Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2020·Granted May 30, 2023·1 cites·19 claims
- 1685US10325874B2Device module having a plurality of dies electrically connected by postsMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 18, 2019·4 cites·20 claims
- 1785US2025118722A1Graphics Processing Unit and High Bandwidth Memory Integration Using Integrated Interface and Silicon InterposerMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1885US2025112105A1Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1984US11206749B2Tubular heat spreaders for memory modules and memory modules incorporating the sameMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 21, 2021·3 cites·15 claims
- 2084US10192843B1Methods of making semiconductor device modules with increased yieldMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 29, 2019·4 cites·20 claims
- 2184US10153221B1Face down dual sided chip scale memory packageMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 11, 2018·5 cites·28 claims
- 2283US11990350B2Semiconductor devices with flexible reinforcement structureMICRON TECHNOLOGY INC·Filed 2023·Granted May 21, 2024·0 cites·20 claims
- 2383US11416437B2Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilitiesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 16, 2022·2 cites·23 claims
- 2483US11264332B2Interposers for microelectronic devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 1, 2022·2 cites·26 claims
- 2582US12277056B2Memory device interface and methodMICRON TECHNOLOGY INC·Filed 2023·Granted Apr 15, 2025·0 cites·17 claims
- 2682US12199001B2Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 2782US10770398B2Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposerMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 8, 2020·3 cites·17 claims
- 2880US12230583B2Interposers for microelectronic devicesMICRON TECHNOLOGY INC·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 2980US2023020689A1Semiconductor device assembly with through-package interconnect and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3079US10586780B2Semiconductor device modules including a die electrically connected to posts and related methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 10, 2020·2 cites·19 claims
- 3179US6934455B2Waveguides with optical monitoringINTEL CORP·Filed 2002·Granted Aug 23, 2005·22 cites·41 claims
- 3279US2024371755A1Low cost three-dimensional stacking semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3378US12170275B2Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposerMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 17, 2024·0 cites·17 claims
- 3476US12062607B2Low cost three-dimensional stacking semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 3576US11784166B2Dual sided fan-out package having low warpage across all temperaturesMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 3676US6973236B2Vertical taper waveguideINTEL CORP·Filed 2002·Granted Dec 6, 2005·17 cites·15 claims
- 3775US12218119B2Stacked interposer structuresMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 4, 2025·0 cites·9 claims
- 3875US2024111707A1Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilitiesLODESTAR LICENSING GROUP LLC·Filed 2023·Application pending·0 cites
- 3974US12218101B2Three-dimensional stacking semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 4, 2025·0 cites·17 claims
- 4074US12211814B2Semiconductor interconnect structures with conductive elements, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·21 claims
- 4174US11444067B2Stacked interposer structures, microelectronic device assemblies including same, and methods of fabrication, and related electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 13, 2022·1 cites·18 claims
- 4274US2025174604A1Three-dimensional stacking semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4373US11789890B2Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilitiesLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Oct 17, 2023·0 cites·21 claims
- 4473US11456286B2Semiconductor device assembly with through-package interconnect and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·0 cites·20 claims
- 4573US2021318956A1Memory device interface and methodMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 4673US2025149530A1Stacked interposer structures, and related methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4772US12243801B2Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 4, 2025·0 cites·19 claims
- 4872US11410981B2Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposerMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·18 claims
- 4971US11410973B2Microelectronic device assemblies and packages and related methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·24 claims
- 5071US11239206B2Dual sided fan-out package having low warpage across all temperaturesMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 1, 2022·0 cites·22 claims
Showing the top 50 of 89 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →