Inventor · disambiguated record
Chee Kheong Yoon
Also filed as: YOON CHEE KHEONG
1 granted patent·12 pending applications·0 citations·filing 2017–2022
1Inventor score
Technology areasH10W
Files withINTEL CORP13
Top patents by PatentIndex Score
13 records- 0147US2024234303A9Integrated inductor over transistor layerINTEL CORP·Filed 2022·Application pending·0 cites
- 0247US2024234234A9Copper fill for heat management in integrated circuit deviceINTEL CORP·Filed 2022·Application pending·0 cites
- 0347US2023395524A1Emi cage for microstrip routing via dual layer underfill conceptINTEL CORP·Filed 2022·Application pending·0 cites
- 0446US2023395578A1Memory package on extended base die over soc die for package layer count and form factor reductionINTEL CORP·Filed 2022·Application pending·0 cites
- 0546US2023420354A1Electrical conductor extending from a surface of a substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 0646US2023420384A1Slotted stiffener for a package substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 0746US2023395576A1Memory on package (mop) architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 0846US2023420350A1Hyper density package substrate and memory coupled to a modified semi-additive process boardINTEL CORP·Filed 2022·Application pending·0 cites
- 0946US2023395493A1On package interconnect architecture for high-speed memoryINTEL CORP·Filed 2022·Application pending·0 cites
- 1046US2023420345A1Copper rings for bga count reduction in small form factor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 1146US2023395577A1Soc-memory integration to achieve smallest and thinnest memory on package architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 1246US2023397333A1Ultra-laser though hole (ulth) by multi-stacked core conceptINTEL CORP·Filed 2022·Application pending·0 cites
- 1333US11133261B2Electronic device packagingINTEL CORP·Filed 2017·Granted Sep 28, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →