Inventor · disambiguated record
Chan Yoon
Also filed as: YOON CHAN · YOON CHAN-SIC
104 granted patents·30 pending applications·221 citations·filing 2012–2024
99Inventor score
Files withSAMSUNG ELECTRO MECH80SAMSUNG ELECTRONICS CO LTD49JEONG YOUNG HAK1JUNG HYEONOK1SAMSUNG ELECTROMECHANICS CO LTD1
Top patents by PatentIndex Score
134 records- 0197US9945042B2Chip electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 17, 2018·18 cites·12 claims
- 0296US10079089B1Coil electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Sep 18, 2018·8 cites·12 claims
- 0396US9576711B2Coil component and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Feb 21, 2017·10 cites·14 claims
- 0495US11527358B2Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 13, 2022·2 cites·12 claims
- 0595US11158455B2Electronic component having body with exposed lower portionSAMSUNG ELECTRO MECH·Filed 2019·Granted Oct 26, 2021·6 cites·16 claims
- 0695US9634012B2Method of forming active patterns, active pattern array, and method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 25, 2017·15 cites·20 claims
- 0794US10373961B2Semiconductor device including contact structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 6, 2019·10 cites·18 claims
- 0894US9655247B1Coil component and board having the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted May 16, 2017·6 cites·20 claims
- 0994US9490062B2Chip electronic componentSAMSUNG ELECTRO MECH·Filed 2014·Granted Nov 8, 2016·13 cites·6 claims
- 1092US10050041B1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 14, 2018·6 cites·10 claims
- 1191US11670451B2Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 6, 2023·1 cites·20 claims
- 1291US11443894B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 13, 2022·2 cites·30 claims
- 1391US10679997B2Semiconductor device comprising work function metal pattern in boundary region and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 9, 2020·5 cites·18 claims
- 1491US10607765B2Coil component and board having the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 31, 2020·4 cites·21 claims
- 1590US11348727B2Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 1690US10957486B2Electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 23, 2021·3 cites·17 claims
- 1790US10109409B2Chip electronic component and board for mounting thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Oct 23, 2018·8 cites·26 claims
- 1890US9627387B2Semiconductor device and method for manufacturing the sameJUNG HYEONOK·Filed 2015·Granted Apr 18, 2017·15 cites·21 claims
- 1990US9478548B2Semiconductor devices and methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 25, 2016·11 cites·14 claims
- 2089US10998324B2Semiconductor device comprising work function metal pattern in boundary region and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 4, 2021·2 cites·20 claims
- 2189US10896967B2Integrated circuit device including gate spacer structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 19, 2021·5 cites·20 claims
- 2289US10332831B2Semiconductor device including a bit lineSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 25, 2019·7 cites·14 claims
- 2389US9960170B1Methods of fabricating memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 1, 2018·6 cites·20 claims
- 2488US10541302B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 21, 2020·7 cites·22 claims
- 2588US9263180B2Coil component and board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 16, 2016·7 cites·18 claims
- 2687US11424065B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 23, 2022·2 cites·19 claims
- 2787US10801121B2Chip electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 13, 2020·1 cites·10 claims
- 2885US11756724B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Sep 12, 2023·2 cites·16 claims
- 2985US11676759B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Jun 13, 2023·1 cites·33 claims
- 3084US12205772B2Multilayer capacitor and substrate including the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2023·Granted Jan 21, 2025·0 cites·12 claims
- 3184US11170927B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Nov 9, 2021·2 cites·17 claims
- 3284US11075030B2Inductor arraySAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 27, 2021·2 cites·16 claims
- 3384US10340073B2Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 2, 2019·2 cites·20 claims
- 3484US9985034B2Method of manufacturing a semiconductor deviceYOON CHAN SIC·Filed 2015·Granted May 29, 2018·5 cites·20 claims
- 3583US11961673B2Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2023·Granted Apr 16, 2024·0 cites·12 claims
- 3683US10629365B2Inductor array component and board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 21, 2020·2 cites·18 claims
- 3783US10559413B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 11, 2020·2 cites·19 claims
- 3882US9208935B2Electronic componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 8, 2015·4 cites·9 claims
- 3981US11201156B2Semiconductor devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 14, 2021·1 cites·20 claims
- 4081US2024096559A1Multi-layered ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 4180US10332894B2Semiconductor device comprising work function metal pattern in boundry region and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 25, 2019·2 cites·19 claims
- 4279US10325802B2Method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 18, 2019·3 cites·20 claims
- 4379US9916979B2Methods for manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 13, 2018·2 cites·20 claims
- 4478US10910363B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·2 cites·18 claims
- 4578US10332890B2Semiconductor memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 25, 2019·2 cites·19 claims
- 4677US12136523B2Multilayer capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2022·Granted Nov 5, 2024·0 cites·21 claims
- 4776US11875948B2Multilayer capacitor and substrate including the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2022·Granted Jan 16, 2024·0 cites·25 claims
- 4876US2023036133A1Multi-layered ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 4972US10784266B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·20 claims
- 5071US12317467B2Semiconductor device comprising work function metal pattern in boundary region and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 27, 2025·0 cites·20 claims
Showing the top 50 of 134 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →