Inventor · disambiguated record
Chul Keun Yoon
Also filed as: YOON CHUL KEUN
4 granted patents·3 citations·filing 2010–2018
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0166US8810309B2Stack package and method for selecting chip in stack packageLEE DAE WOONG·Filed 2011·Granted Aug 19, 2014·3 cites·5 claims
- 0249US10393646B2Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the sameSK HYNIX INC·Filed 2018·Granted Aug 27, 2019·0 cites·9 claims
- 0346US9945772B2Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the sameSK HYNIX INC·Filed 2016·Granted Apr 17, 2018·0 cites·18 claims
- 0436US8164200B2Stack semiconductor package and method for manufacturing the sameKANG TAE MIN·Filed 2010·Granted Apr 24, 2012·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →