Inventor · disambiguated record
Chong Kwang Yoon
Also filed as: YOON CHONG · YOON CHONG KWANG
6 granted patents·5 pending applications·73 citations·filing 1997–2016
82Inventor score
Top patents by PatentIndex Score
11 records- 0188US8335084B2Embedded actives and discrete passives in a cavity within build-up layersLEE BAIK-WOO·Filed 2006·Granted Dec 18, 2012·27 cites·9 claims
- 0268US9601842B2Connecting unit having a column with a plurality of planar elastic fins extending from the columnUNID CO LTD·Filed 2013·Granted Mar 21, 2017·3 cites·39 claims
- 0354US6320249B1Multiple line grids incorporating therein circuit elementsGLOTECH INC·Filed 1999·Granted Nov 20, 2001·22 cites·15 claims
- 0451US5866493AMethod of manufacturing a sintered body of indium tin oxideKOREA ACADEMY IND TECHNOLOGY·Filed 1997·Granted Feb 2, 1999·15 cites·4 claims
- 0547US11292884B2Organic-inorganic-hybrid thin film and method of manufacturing the sameUNID CO LTD·Filed 2016·Granted Apr 5, 2022·0 cites·17 claims
- 0634US2001040297A1Multiple line grid for use in a packaging of a testing applicationFiled 2001·Application pending·0 cites
- 0733US2006258327A1Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materialsLEE BAIK-WOO·Filed 2006·Application pending·0 cites
- 0833US2002055283A1Multiple line grid connectorGLOTECH INC·Filed 2001·Application pending·0 cites
- 0930US2018013219A1Matable electrical interconnection structure and electrical device having the sameUNID CO LTD·Filed 2015·Application pending·0 cites
- 1029US2018013251A1Method for manufacturing electrical interconnection structureUNID CO LTD·Filed 2015·Application pending·0 cites
- 1126US6384477B2Multiple line grid array packageGLOTECH INC·Filed 1998·Granted May 7, 2002·6 cites·35 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →