Inventor · disambiguated record
Chikako Yoshida
Also filed as: YOSHIDA CHIKAKO
11 granted patents·1 pending application·158 citations·filing 1990–2021
88Inventor score
Top patents by PatentIndex Score
12 records- 0195US7924138B2Semiconductor device and manufacturing method of the sameFUJITSU LTD·Filed 2009·Granted Apr 12, 2011·109 cites·17 claims
- 0284US11087909B2Electronic component, electronic apparatus, and method for manufacturing electronic componentTAIYO YUDEN KK·Filed 2018·Granted Aug 10, 2021·4 cites·12 claims
- 0369US11631524B2Coil component with coil having certain cross-sectional shapeTAIYO YUDEN KK·Filed 2021·Granted Apr 18, 2023·0 cites·10 claims
- 0469US11532415B2Electronic component and electronic apparatusTAIYO YUDEN KK·Filed 2021·Granted Dec 20, 2022·0 cites·9 claims
- 0561US11056269B2Coil component and method for manufacturing coil componentTAIYO YUDEN KK·Filed 2018·Granted Jul 6, 2021·0 cites·9 claims
- 0660US6946351B2Method for fabricating a semiconductor deviceFUJITSU LTD·Filed 2004·Granted Sep 20, 2005·6 cites·9 claims
- 0755US6780699B2Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2003·Granted Aug 24, 2004·5 cites·20 claims
- 0855US5416717ACircuit simulation method for a circuit realized by an LSI layout pattern based upon a circuit of a logic gate level realized by the layout patternHITACHI LTD·Filed 1990·Granted May 16, 1995·31 cites·26 claims
- 0949US7741684B2Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2005·Granted Jun 22, 2010·0 cites·4 claims
- 1039US8102003B2Resistance memory element, method of manufacturing resistance memory element and semiconductor memory deviceYOSHIDA CHIKAKO·Filed 2009·Granted Jan 24, 2012·0 cites·2 claims
- 1133US5950103AManufacture of dielectric oxide lamination structure and electronic circuit deviceFUJITSU LTD·Filed 1996·Granted Sep 7, 1999·3 cites·14 claims
- 1233US2003222316A1Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →