Inventor · disambiguated record
Chun-Hsien Yu
Also filed as: YU CHUN · YU CHUN-HSIEN
28 granted patents·6 pending applications·20 citations·filing 2011–2022
92Inventor score
Files withPHOENIX PIONEER TECHNOLOGY CO LTD21HTC CORP4ACER INC3CHEN DONG-SEN2ADVANCED SEMICONDUCTOR ENG1
Top patents by PatentIndex Score
34 records- 0195US11749612B2Semiconductor package devicePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2021·Granted Sep 5, 2023·3 cites·10 claims
- 0285US9754982B2Packaging module and substrate structure thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Sep 5, 2017·5 cites·20 claims
- 0384US11887299B2Image processing system and image processing methodACER INC·Filed 2021·Granted Jan 30, 2024·2 cites·20 claims
- 0481US11238374B2Method for verifying training data, training system, and computer readable mediumHTC CORP·Filed 2019·Granted Feb 1, 2022·4 cites·18 claims
- 0581US11183447B2Flip-chip package substrate and method for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted Nov 23, 2021·1 cites·10 claims
- 0676US11476204B2Flip-chip packaging substrate and method for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2019·Granted Oct 18, 2022·2 cites·3 claims
- 0776US11379722B2Method for training generative adversarial network (GAN), method for generating images by using GAN, and computer readable storage mediumHTC CORP·Filed 2020·Granted Jul 5, 2022·1 cites·20 claims
- 0869US9824964B2Package substrate, package structure including the same, and their fabrication methodsPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Nov 21, 2017·1 cites·6 claims
- 0966US12154866B2Method of fabricating a flip-chip package core substrate with build-up layersPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·2 claims
- 1065US9711445B2Package substrate, package structure including the same, and their fabrication methodsPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Jul 18, 2017·1 cites·8 claims
- 1160US12094922B2Inductance traces protected through shielding layersPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·16 claims
- 1259US2020332429A1Method of fabricating package substratesPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 1356US11404348B2Semiconductor package carrier board, method for fabricating the same, and electronic package having the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·16 claims
- 1454US11335630B2Semiconductor package substrate, electronic package and methods for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted May 17, 2022·0 cites·10 claims
- 1553US2020065706A1Method for verifying training data, training system, and computer program productHTC CORP·Filed 2019·Application pending·0 cites
- 1651US11508673B2Semiconductor packaging substrate, fabrication method and packaging process thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·8 claims
- 1751US10745818B2Method of fabricating package substratesPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Aug 18, 2020·0 cites·5 claims
- 1850US11791281B2Package substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 17, 2023·0 cites·13 claims
- 1950US11450597B2Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·8 claims
- 2046US11646331B2Package substratePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted May 9, 2023·0 cites·11 claims
- 2146US9852977B2Package substratePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Dec 26, 2017·0 cites·16 claims
- 2244US11139230B2Flip-chip package substrate and method for preparing the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·15 claims
- 2344US10366906B2Electronic package and its package substratePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Jul 30, 2019·0 cites·10 claims
- 2443US2020305289A1Flexible substrate and method for fabricating the samePHOENIX & CORP·Filed 2019·Application pending·0 cites
- 2541US11253228B2Ultrasonic scanning method and ultrasonic scanning deviceACER INC·Filed 2019·Granted Feb 22, 2022·0 cites·6 claims
- 2641US2019108442A1Machine learning system, machine learning method and non-transitory computer readable medium for operating the sameHTC CORP·Filed 2018·Application pending·0 cites
- 2741US2019279925A1Semiconductor package structure and method of making the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2019·Application pending·0 cites
- 2840US11483939B2Electronic device with display interfaceDELTA ELECTRONICS INC·Filed 2021·Granted Oct 25, 2022·0 cites·7 claims
- 2940US8837133B2Display moduleCHEN DONG-SEN·Filed 2011·Granted Sep 16, 2014·0 cites·8 claims
- 3039US10278282B2Substrate structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Apr 30, 2019·0 cites·9 claims
- 3139US8514554B2Display moduleCHEN DONG-SEN·Filed 2011·Granted Aug 20, 2013·0 cites·7 claims
- 3239US2018189179A1Dynamic memory banksQUALCOMM INC·Filed 2017·Application pending·0 cites
- 3336US11455498B2Model training method and electronic deviceACER INC·Filed 2020·Granted Sep 27, 2022·0 cites·9 claims
- 3435US10347575B2Package substrate and its fabrication methodPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Jul 9, 2019·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →