Inventor · disambiguated record
Ching-Pin Yuan
Also filed as: YUAN CHING-PIN
16 granted patents·1 pending application·97 citations·filing 2010–2025
90Inventor score
Top patents by PatentIndex Score
17 records- 0198US11309223B2Method of forming semiconductor device package having dummy devices on a first dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·7 cites·20 claims
- 0298US9899355B2Three-dimensional integrated circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·71 cites·16 claims
- 0397US10672674B2Method of forming semiconductor device package having testing pads on a topmost dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·17 cites·20 claims
- 0484US2025364303A1Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0581US12020997B2Methods of forming semiconductor device packages having alignment marks on a carrier substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 0677US12441097B2Lamination process, and manufacturing method of semiconductor package using a chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 0777US11721598B2Method of forming semiconductor device package having testing pads on an upper dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 0875US12391033B2Lamination process, and manufacturing method of semiconductor package using a chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0975US11916031B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 1073US12500113B2Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·14 claims
- 1172US10784219B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·20 claims
- 1270US11335656B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 1367US11993066B2Chuck, lamination process, and manufacturing method of semiconductor package using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 1465US9875982B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 23, 2018·1 cites·20 claims
- 1556US10347607B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·0 cites·20 claims
- 1653US8552743B2Microwave diffraction systemCHANG TSUN-HSU·Filed 2010·Granted Oct 8, 2013·0 cites·19 claims
- 1751US10147704B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 4, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →