Inventor · disambiguated record
Cheol-Ju Yun
Also filed as: YUN CHEOL-JU
28 granted patents·6 pending applications·238 citations·filing 1999–2025
96Inventor score
Top patents by PatentIndex Score
34 records- 0193US7488644B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 10, 2009·20 cites·9 claims
- 0290US7247541B2Method of manufacturing a semiconductor memory device including a transistorSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 24, 2007·12 cites·7 claims
- 0389US9184091B2Semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 10, 2015·14 cites·17 claims
- 0487US8987860B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 24, 2015·10 cites·20 claims
- 0585US7321146B2DRAM memory cell and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 22, 2008·11 cites·12 claims
- 0683US2025311208A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0780US8946077B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 3, 2015·6 cites·20 claims
- 0880US7388243B2Self-Aligned buried contact pairSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 17, 2008·8 cites·15 claims
- 0978US7482222B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 27, 2009·4 cites·4 claims
- 1077US7056786B2Self-aligned buried contact pair and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 6, 2006·20 cites·35 claims
- 1176US7326613B2Methods of manufacturing semiconductor devices having elongated contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 5, 2008·9 cites·23 claims
- 1275US7078292B2Storage node contact forming method and structure for use in semiconductor memorySAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 18, 2006·20 cites·24 claims
- 1374US7307305B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 11, 2007·4 cites·19 claims
- 1473US7476585B2Semiconductor device including storage node and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 13, 2009·3 cites·15 claims
- 1573US7026246B2Method of cleaning semiconductor substrates after forming tungsten patternsSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 11, 2006·15 cites·7 claims
- 1673US2025126816A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1772US6916738B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 12, 2005·13 cites·17 claims
- 1871US7557410B2Dynamic random access memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 7, 2009·2 cites·8 claims
- 1971US6967150B2Method of forming self-aligned contact in fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 22, 2005·16 cites·12 claims
- 2070US12356610B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·19 claims
- 2168US12211891B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 2266US7205232B2Method of forming a self-aligned contact structure using a sacrificial mask layerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 17, 2007·13 cites·50 claims
- 2366US7030439B2DRAM memory cell and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 18, 2006·11 cites·11 claims
- 2465US7547938B2Semiconductor devices having elongated contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 16, 2009·3 cites·13 claims
- 2563US7180118B2Semiconductor device including storage node and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 20, 2007·7 cites·16 claims
- 2662US7691719B2Semiconductor device having storage nodes and its method of fabricationSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 6, 2010·2 cites·16 claims
- 2761US6773338B2Polishing head and chemical mechanical polishing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 10, 2004·7 cites·13 claims
- 2858US9343355B2Wiring structures including spacers and an airgap defined thereby, and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 17, 2016·1 cites·16 claims
- 2956US2005186732A1Semiconductor devices having plug contact holes extending downward from a main surface of a semiconductor substrate and methods of forming the sameFiled 2005·Application pending·0 cites
- 3044US7166507B2Semiconductor device and method for forming same using multi-layered hard maskSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 23, 2007·1 cites·20 claims
- 3141US2006057783A1Methods of forming fuses using selective etching of capping layersYUN CHEOL-JU·Filed 2005·Application pending·0 cites
- 3240US2005272250A1Method of forming self-aligned contact and method of manufacturing semiconductor memory device by using the sameYUN CHEOL-JU·Filed 2005·Application pending·0 cites
- 3338US2004266170A1Method of forming contacts in semiconductor deviceFiled 2004·Application pending·0 cites
- 3436US6635582B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Oct 21, 2003·6 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →