Inventor · disambiguated record
Changsun Yun
Also filed as: YUN CHANGSUN
7 granted patents·4 pending applications·1 citations·filing 2019–2025
69Inventor score
Top patents by PatentIndex Score
11 records- 0178US2025391738A1Jet impingement heatsink for high power semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0274US11073944B2Cooking apparatus and controlling method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 27, 2021·1 cites·15 claims
- 0371US12400933B2Jet impingement heatsink for high power semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 0469US12476397B2Transfer molded power modules and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0553US2024332117A1Power module utilizing injectable conductive component for direct coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0646US12096539B2Cooking apparatus and control method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 17, 2024·0 cites·11 claims
- 0742US2021068208A1Cooking apparatus and method for controlling the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 0840US11836305B2Cooking device and control method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 5, 2023·0 cites·9 claims
- 0937US11612020B2Cooking apparatus and method for controlling thereofSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 21, 2023·0 cites·10 claims
- 1037US2020323048A1Induction heating apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 1135US11949329B2Induction heating cooking apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →