Inventor · disambiguated record
Chong Zhang
Also filed as: ZHANG CHONG · ZHANG CHONG YI
95 granted patents·54 pending applications·344 citations·filing 2006–2025
99Inventor score
Top patents by PatentIndex Score
149 records- 0197US11899251B2Vertical integrated photonics chiplet for in-package optical interconnectAYAR LABS INC·Filed 2020·Granted Feb 13, 2024·4 cites·19 claims
- 0297US11557579B2Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2020·Granted Jan 17, 2023·5 cites·23 claims
- 0396US11696407B2Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrateINTEL CORP·Filed 2021·Granted Jul 4, 2023·3 cites·21 claims
- 0496US11500153B2Multi-chip packaging of silicon photonicsAYAR LABS INC·Filed 2020·Granted Nov 15, 2022·38 cites·30 claims
- 0596US11287573B1Heterogeneously integrated photonic devices with improved optical coupling between waveguidesZHANG CHONG·Filed 2020·Granted Mar 29, 2022·14 cites·9 claims
- 0696US9147638B2Interconnect structures for embedded bridgeINTEL CORP·Filed 2013·Granted Sep 29, 2015·51 cites·11 claims
- 0795US11719883B1Integrated GaAs active devices with improved optical coupling to dielectric waveguidesZHANG CHONG·Filed 2022·Granted Aug 8, 2023·6 cites·17 claims
- 0895US11209592B2Integrated active devices with enhanced optical coupling to dielectric waveguidesZHANG CHONG·Filed 2020·Granted Dec 28, 2021·9 cites·20 claims
- 0994US9119313B2Package substrate with high density interconnect design to capture conductive features on embedded dieINTEL CORP·Filed 2013·Granted Aug 25, 2015·23 cites·25 claims
- 1094US7630147B1Laser beam shaping for pitchfork profileUNIV CENTRAL FLORIDA RES FOUND·Filed 2007·Granted Dec 8, 2009·46 cites·10 claims
- 1193US9917044B2Package with bi-layered dielectric structureINTEL CORP·Filed 2015·Granted Mar 13, 2018·12 cites·25 claims
- 1292US11808997B1Heterogeneous photonic integrated circuits with doped waveguidesNEXUS PHOTONICS INC·Filed 2022·Granted Nov 7, 2023·5 cites·18 claims
- 1391US11521914B2Microelectronic assemblies having a cooling channelINTEL CORP·Filed 2018·Granted Dec 6, 2022·8 cites·13 claims
- 1491US11387224B2Phase change material in substrate cavityINTEL CORP·Filed 2018·Granted Jul 12, 2022·7 cites·20 claims
- 1590US11646254B2Electronic device including a lateral traceTAHOE RES LTD·Filed 2020·Granted May 9, 2023·2 cites·25 claims
- 1690USD965209SLED light panelSHENZHEN THANKSHOME TECH CO LTD·Filed 2021·Granted Sep 27, 2022·17 cites·1 claims
- 1790US11217473B1Peeling deviceTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2020·Granted Jan 4, 2022·2 cites·14 claims
- 1890US10804188B2Electronic device including a lateral traceINTEL CORP·Filed 2018·Granted Oct 13, 2020·5 cites·9 claims
- 1989US10751810B2Vertical-edge double-step sawtooth cutter for preparing high-quality holes of composite material and hybrid stack structure thereofUNIV DALIAN TECH·Filed 2018·Granted Aug 25, 2020·6 cites·1 claims
- 2088US11422322B2Hybrid multi-wavelength source and associated methodsAYAR LABS INC·Filed 2020·Granted Aug 23, 2022·2 cites·21 claims
- 2187US11480734B2Active-passive photonic integrated circuit platformPARK HYUNDAI·Filed 2019·Granted Oct 25, 2022·6 cites·9 claims
- 2286US10811549B2Quantum-dot-based avalanche photodiodes on siliconHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Oct 20, 2020·2 cites·20 claims
- 2386US9202803B2Laser cavity formation for embedded dies or components in substrate build-up layersZHANG CHONG·Filed 2014·Granted Dec 1, 2015·8 cites·14 claims
- 2484US12353014B2Mode control in heterogeneously integrated photonicsKOMLJENOVIC TIN·Filed 2023·Granted Jul 8, 2025·1 cites·17 claims
- 2584US12168813B2Electrokinetic device and method for in-situ leaching of uraniumUNIV SOUTH CHINA·Filed 2023·Granted Dec 17, 2024·2 cites·6 claims
- 2684US9953959B1Metal protected fan-out cavityINTEL CORP·Filed 2017·Granted Apr 24, 2018·4 cites·8 claims
- 2783US11552008B2Asymmetric cored integrated circuit package supportsINTEL CORP·Filed 2018·Granted Jan 10, 2023·3 cites·24 claims
- 2883US10963214B2Audio output method, electronic device, and storage mediumHUAWEI TECH CO LTD·Filed 2020·Granted Mar 30, 2021·2 cites·20 claims
- 2983US2024405006A1Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2024·Application pending·0 cites
- 3080US12087746B2Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 3177US10620908B2Audio output method, electronic device, and storage mediumHUAWEI TECH CO LTD·Filed 2016·Granted Apr 14, 2020·2 cites·20 claims
- 3276US7441760B2Work tableCHEVRON LTD·Filed 2007·Granted Oct 28, 2008·11 cites·15 claims
- 3376US2024418535A1Synchronizing neighboring tiles in a high definition mapTOYOTA RES INST INC·Filed 2024·Application pending·0 cites
- 3475US11721677B2Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2018·Granted Aug 8, 2023·1 cites·24 claims
- 3574US7701410B2Dual-mode antenna deviceHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Apr 20, 2010·8 cites·11 claims
- 3673US12066865B2Adjustable frame and foldable display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2020·Granted Aug 20, 2024·1 cites·17 claims
- 3773US2023352385A1Electronic device including a lateral traceTAHOE RES LTD·Filed 2023·Application pending·0 cites
- 3873US2024176081A1Vertical Integrated Photonics Chiplet for In-Package Optical InterconnectAYAR LABS INC·Filed 2024·Application pending·0 cites
- 3972US12019269B2Multi-chip packaging of silicon photonicsAYAR LABS INC·Filed 2022·Granted Jun 25, 2024·0 cites·15 claims
- 4072US10396521B2LaserHEWLETT PACKARD ENTPR DEV LP·Filed 2017·Granted Aug 27, 2019·1 cites·19 claims
- 4171US12422632B2Systems and methods for passively-aligned optical waveguide edge-couplingAYAR LABS INC·Filed 2023·Granted Sep 23, 2025·0 cites·19 claims
- 4271US8094076B2Multiband antennaZHANG CHONG·Filed 2009·Granted Jan 10, 2012·7 cites·11 claims
- 4370US10790159B2Semiconductor package substrate with through-hole magnetic core inductor using conductive pasteINTEL CORP·Filed 2018·Granted Sep 29, 2020·1 cites·15 claims
- 4470US10777514B2Techniques for an inductor at a second level interfaceINTEL CORP·Filed 2018·Granted Sep 15, 2020·1 cites·16 claims
- 4569US12104922B2Synchronizing neighboring tiles in a high definition mapTOYOTA RES INST INC·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 4669US11507340B2Audio output method, electronic device, and storage mediumHONOR DEVICE CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 4769US2025387906A1Robot control method and apparatus, electronic device, computer-readable storage medium, and computer program productTENCENT TECH SHENZHEN CO LTD·Filed 2025·Application pending·0 cites
- 4868US2025389904A1Non-Physical-Contact Optical Fiber ConnectorAYAR LABS INC·Filed 2025·Application pending·0 cites
- 4968US2023187205A1Substrate package with glass dielectricINTEL CORP·Filed 2023·Application pending·0 cites
- 5067US12444906B2Heterogeneously integrated photonic platform with improved thermal performanceZHANG CHONG·Filed 2022·Granted Oct 14, 2025·0 cites·19 claims
Showing the top 50 of 149 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →