Inventor · disambiguated record
Chonghua Zhong
Also filed as: ZHONG CHONGHUA
31 granted patents·9 pending applications·225 citations·filing 2008–2025
96Inventor score
Top patents by PatentIndex Score
40 records- 0198US11587909B2High bandwidth die to die interconnect with package area reductionAPPLE INC·Filed 2020·Granted Feb 21, 2023·9 cites·18 claims
- 0298US9633974B2System in package fan out stacking architecture and process flowAPPLE INC·Filed 2015·Granted Apr 25, 2017·57 cites·16 claims
- 0397US10943869B2High density interconnection using fanout interposer chipletAPPLE INC·Filed 2017·Granted Mar 9, 2021·22 cites·20 claims
- 0497US9935076B1Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2016·Granted Apr 3, 2018·16 cites·10 claims
- 0597US9659907B2Double side mounting memory integration in thin low warpage fanout packageAPPLE INC·Filed 2015·Granted May 23, 2017·26 cites·20 claims
- 0696US12368137B2High bandwidth die to die interconnect with package area reductionAPPLE INC·Filed 2023·Granted Jul 22, 2025·2 cites·19 claims
- 0796US12283549B2High density interconnection using fanout interposer chipletAPPLE INC·Filed 2023·Granted Apr 22, 2025·2 cites·15 claims
- 0894US9548288B1Integrated circuit die decoupling system with reduced inductanceAPPLE INC·Filed 2015·Granted Jan 17, 2017·17 cites·17 claims
- 0993US11594494B2High density interconnection using fanout interposer chipletAPPLE INC·Filed 2021·Granted Feb 28, 2023·2 cites·20 claims
- 1093US7781882B2Low voltage drop and high thermal performance ball grid array packageBROADCOM CORP·Filed 2009·Granted Aug 24, 2010·22 cites·25 claims
- 1191US10770433B1High bandwidth die to die interconnect with package area reductionAPPLE INC·Filed 2019·Granted Sep 8, 2020·5 cites·20 claims
- 1290US10181455B23D thin profile pre-stacking architecture using reconstitution methodAPPLE INC·Filed 2017·Granted Jan 15, 2019·6 cites·19 claims
- 1389US10818632B1Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2018·Granted Oct 27, 2020·3 cites·14 claims
- 1485US11967528B2Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
- 1584US8922014B2Wafer level semiconductor packageBROADCOM CORP·Filed 2013·Granted Dec 30, 2014·5 cites·22 claims
- 1683US9748227B2Dual-sided silicon integrated passive devicesAPPLE INC·Filed 2016·Granted Aug 29, 2017·3 cites·11 claims
- 1783US8957694B2Wafer level package resistance monitor schemeHU KUNZHONG·Filed 2012·Granted Feb 17, 2015·7 cites·18 claims
- 1881US8417200B1Wideband power efficient high transmission power radio frequency (RF) transmitterGOMEZ RAY RAMON·Filed 2011·Granted Apr 9, 2013·6 cites·22 claims
- 1980US11158621B2Double side mounted large MCM package with memory channel length reductionAPPLE INC·Filed 2020·Granted Oct 26, 2021·1 cites·18 claims
- 2079US2025167048A1Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator ModuleAPPLE INC·Filed 2025·Application pending·0 cites
- 2176US11069665B2Trimmable banked capacitorAPPLE INC·Filed 2018·Granted Jul 20, 2021·2 cites·23 claims
- 2276US2025157939A1High density interconnection using fanout interposer chipletAPPLE INC·Filed 2025·Application pending·0 cites
- 2375US11670548B2Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2020·Granted Jun 6, 2023·0 cites·18 claims
- 2473US7683495B2Integrated circuit package substrate having configurable bond padsBROADCOM CORP·Filed 2008·Granted Mar 23, 2010·5 cites·10 claims
- 2571US10685948B1Double side mounted large MCM package with memory channel length reductionAPPLE INC·Filed 2018·Granted Jun 16, 2020·1 cites·21 claims
- 2669US8592259B2Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layerHU KEVIN KUNZHONG·Filed 2011·Granted Nov 26, 2013·2 cites·20 claims
- 2763US8102027B2IC package sacrificial structures for crack propagation confinementZHAO SAM ZIQUN·Filed 2008·Granted Jan 24, 2012·2 cites·32 claims
- 2863US2023017445A1Scalable Extreme Large Size Substrate IntegrationAPPLE INC·Filed 2022·Application pending·0 cites
- 2960US9118367B2Wideband power efficient high transmission power radio frequency (RF) transmitterBROADCOM CORP·Filed 2013·Granted Aug 25, 2015·1 cites·20 claims
- 3058US11404337B2Scalable extreme large size substrate integrationAPPLE INC·Filed 2019·Granted Aug 2, 2022·0 cites·17 claims
- 3157US2024105704A13D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer BondingAPPLE INC·Filed 2023·Application pending·0 cites
- 3256US9153530B2Thermal enhanced high density flip chip packageZHONG CHONGHUA·Filed 2011·Granted Oct 6, 2015·1 cites·20 claims
- 3355US8945991B2Fabricating a wafer level semiconductor package having a pre-formed dielectric layerBROADCOM CORP·Filed 2013·Granted Feb 3, 2015·0 cites·25 claims
- 3454US2024105702A13D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer BondingAPPLE INC·Filed 2023·Application pending·0 cites
- 3553US2016013156A1Package-on-package options with multiple layer 3-d stackingAPPLE INC·Filed 2014·Application pending·0 cites
- 3652US10103138B2Dual-sided silicon integrated passive devicesAPPLE INC·Filed 2017·Granted Oct 16, 2018·0 cites·14 claims
- 3748US2025336906A1Stacked Chip Assemblies for Display SystemsAPPLE INC·Filed 2025·Application pending·0 cites
- 3847US2016300823A1Package-on-package options with multiple layer 3-d stackingAPPLE INC·Filed 2016·Application pending·0 cites
- 3945US2015364454A1Reconfigured wide i/o memory modules and package architectures using sameAPPLE INC·Filed 2014·Application pending·0 cites
- 4041US8138608B2Integrated circuit package substrate having configurable bond padsZHONG CHONGHUA·Filed 2010·Granted Mar 20, 2012·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →