Inventor · disambiguated record
Cing-He Chen
Also filed as: CHEN CING-HE
2 granted patents·1 pending application·8 citations·filing 2013–2022
54Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0178US11728238B2Semiconductor package with heat dissipation films and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·2 cites·21 claims
- 0278US8945983B2System and method to improve package and 3DIC yield in underfill processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·6 cites·20 claims
- 0364US2022336321A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →