Inventor · disambiguated record
Cing-Yao Jhan
Also filed as: JHAN CING-YAO
0 granted patents·5 pending applications·0 citations·filing 2022–2025
Top patents by PatentIndex Score
5 records- 0158US2025218875A1Semiconductor deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0258US2025174557A1Semiconductor die having a die damage ring and fabrication method thereofMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0357US2025174500A1Semiconductor package with system test ringMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0449US2023387210A1Semiconductor devices and methods for fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0544US2025253267A1Semiconductor deviceMEDIATEK INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →