Inventor · disambiguated record
Clay Arrington
Also filed as: ARRINGTON CLAY · ARRINGTON CLAY BRADLEY
0 granted patents·14 pending applications·0 citations·filing 2021–2023
Top patents by PatentIndex Score
14 records- 0170US2025122340A1Polyetherimide having metal-substituted anionic pendant groupsSHPP GLOBAL TECH BV·Filed 2022·Application pending·0 cites
- 0267US2024270929A1Capillary underfill formulations that include carbon nanotubes, containers, and methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 0364US2025043078A1Polyetherimide having reactive branchingSHPP GLOBAL TECH BV·Filed 2022·Application pending·0 cites
- 0458US2025218999A1Passive component assembly for thickness modification to match core thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 0557US2025219028A1Deep trench capacitors in multi-core integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0657US2025220818A1Flow enhanced dummy structure to enable capillary flow based sidewall fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 0757US2025218964A1Technologies for connected components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 0857US2025218904A1Technologies for power and spacer components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 0957US2025218960A1Methods and apparatus to embed semiconductor devices in cores of package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1056US2023340203A1Polymers, compositions and method for manufacturing an article by 3d printingSOLVAY SPECIALTY POLYMERS USA·Filed 2021·Application pending·0 cites
- 1156US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1255US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1354US2024332125A12d fillers for reduced cte for pidINTEL CORP·Filed 2023·Application pending·0 cites
- 1453US2025210398A1Patternable bond-debond processes and apparatusesINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →