Inventor · disambiguated record
Clay L. Cirino
Also filed as: CIRINO CLAY L
7 granted patents·762 citations·filing 1995–1999
91Inventor score
Top patents by PatentIndex Score
7 records- 0196US5907477ASubstrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulantMICRON COMMUNICATIONS INC·Filed 1997·Granted May 25, 1999·290 cites·11 claims
- 0294US5972152AMethods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrierMICRON COMMUNICATIONS INC·Filed 1997·Granted Oct 26, 1999·193 cites·38 claims
- 0389US6458234B1Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrateMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 1, 2002·65 cites·16 claims
- 0489US5612513AArticle and method of manufacturing an enclosed electrical circuit using an encapsulantMICRON COMMUNICATIONS INC·Filed 1995·Granted Mar 18, 1997·99 cites·34 claims
- 0585US6016746AFlip chip screen printing methodMICRON COMMUNICATIONS INC·Filed 1997·Granted Jan 25, 2000·43 cites·1 claims
- 0672US5700981AEncapsulated electronic component and method for encapsulating an electronic componentMICRON COMMUNICATIONS INC·Filed 1996·Granted Dec 23, 1997·40 cites·32 claims
- 0768US5973263AEncapsulated electronic component and method for encapsulating an electronic componentMICRON COMMUNICATIONS INC·Filed 1997·Granted Oct 26, 1999·32 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →