Inventor · disambiguated record
Claudius Feger
Also filed as: FEGER CLAUDIUS
52 granted patents·7 pending applications·1,377 citations·filing 1988–2019
99Inventor score
Top patents by PatentIndex Score
59 records- 0199US7402442B2Physically highly secure multi-chip assemblyIBM·Filed 2005·Granted Jul 22, 2008·243 cites·7 claims
- 0298US7768005B2Physically highly secure multi-chip assemblyIBM·Filed 2008·Granted Aug 3, 2010·73 cites·17 claims
- 0396US10392555B2Nanoparticle design for enhanced oil recoveryIBM·Filed 2015·Granted Aug 27, 2019·16 cites·8 claims
- 0496US6929900B2Tamper-responding encapsulated enclosure having flexible protective mesh structureIBM·Filed 2003·Granted Aug 16, 2005·127 cites·6 claims
- 0595US6686539B2Tamper-responding encapsulated enclosure having flexible protective mesh structureIBM·Filed 2001·Granted Feb 3, 2004·109 cites·17 claims
- 0695US6672759B2Method for accounting for clamp expansion in a coefficient of thermal expansion measurementIBM·Filed 1998·Granted Jan 6, 2004·163 cites·39 claims
- 0792US9310285B1Method and integrated device for analyzing liquid flow and liquid-solid interface interactionIBM·Filed 2014·Granted Apr 12, 2016·10 cites·22 claims
- 0892US8820612B2Injection molded solder process for forming solder bumps on substratesFEGER CLAUDIUS·Filed 2012·Granted Sep 2, 2014·13 cites·9 claims
- 0991US10444184B2Operation of diagnostic devices involving microchannels and electrodesIBM·Filed 2016·Granted Oct 15, 2019·4 cites·17 claims
- 1089US8963340B2No flow underfill or wafer level underfill and solder columnsFEGER CLAUDIUS·Filed 2011·Granted Feb 24, 2015·8 cites·16 claims
- 1188US9759643B2Method and integrated device for analyzing liquid flow and liquid-solid interface interactionIBM·Filed 2016·Granted Sep 12, 2017·3 cites·7 claims
- 1288US8938627B2Multilayer securing structure and method thereof for the protection of cryptographic keys and codeOGGIONI STEFANO S·Filed 2010·Granted Jan 20, 2015·13 cites·13 claims
- 1388US6924171B2Bilayer wafer-level underfillIBM·Filed 2001·Granted Aug 2, 2005·51 cites·22 claims
- 1488US5619357AFlat panel display containing black matrix polymerIBM·Filed 1995·Granted Apr 8, 1997·95 cites·10 claims
- 1587US7452568B2Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formationIBM·Filed 2005·Granted Nov 18, 2008·15 cites·1 claims
- 1685US8875978B2Forming constant diameter spherical metal ballsIBM·Filed 2013·Granted Nov 4, 2014·3 cites·5 claims
- 1783US6423566B1Moisture and ion barrier for protection of devices and interconnect structuresIBM·Filed 2000·Granted Jul 23, 2002·28 cites·10 claims
- 1881US6817538B2Method and system for preventing parallel marketing of wholesale and retail itemsIBM·Filed 2002·Granted Nov 16, 2004·20 cites·7 claims
- 1978US7776993B2Underfilling with acid-cleavable acetal and ketal epoxy oligomersIBM·Filed 2005·Granted Aug 17, 2010·8 cites·13 claims
- 2078US7516674B1Method and apparatus for thermally induced testing of materials under transient temperatureIBM·Filed 2008·Granted Apr 14, 2009·5 cites·1 claims
- 2177US8408448B1Forming constant diameter spherical metal ballsFEGER CLAUDIUS·Filed 2012·Granted Apr 2, 2013·3 cites·10 claims
- 2277US6919420B2Acid-cleavable acetal and ketal based epoxy oligomersIBM·Filed 2002·Granted Jul 19, 2005·21 cites·23 claims
- 2375US7981849B2Reversible thermal thickening greaseIBM·Filed 2007·Granted Jul 19, 2011·2 cites·15 claims
- 2474US6130472AMoisture and ion barrier for protection of devices and interconnect structuresIBM·Filed 1998·Granted Oct 10, 2000·38 cites·8 claims
- 2573US8496159B2Injection molded solder process for forming solder bumps on substratesFEGER CLAUDIUS·Filed 2011·Granted Jul 30, 2013·3 cites·11 claims
- 2673US8178153B2Heat transfer control structures using thermal phonon spectral overlapFEGER CLAUDIUS·Filed 2006·Granted May 15, 2012·7 cites·6 claims
- 2772US5382637ASolid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis basesIBM·Filed 1991·Granted Jan 17, 1995·24 cites·11 claims
- 2871US6181554B1Portable computer riser for enhanced coolingIBM·Filed 1998·Granted Jan 30, 2001·60 cites·10 claims
- 2968US11555801B2Operation of diagnostic devices involving microchannels and electrodesIBM·Filed 2019·Granted Jan 17, 2023·0 cites·8 claims
- 3068US11021646B2Nanoparticle design for enhanced oil recoveryIBM·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 3168US7442049B2Electrical connecting device and method of forming sameIBM·Filed 2005·Granted Oct 28, 2008·10 cites·16 claims
- 3268US5288842AMorphological composite materials formed from different precursorsIBM·Filed 1991·Granted Feb 22, 1994·16 cites·33 claims
- 3365US7523852B2Solder interconnect structure and method using injection molded solderIBM·Filed 2004·Granted Apr 28, 2009·11 cites·13 claims
- 3463US7815968B2Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formationIBM·Filed 2008·Granted Oct 19, 2010·2 cites·46 claims
- 3559US7773220B2Method and system for collecting alignment data from coated chips or wafersIBM·Filed 2008·Granted Aug 10, 2010·1 cites·20 claims
- 3659US5546655AMethod of applying flex tape protective coating onto a flex productIBM·Filed 1994·Granted Aug 20, 1996·21 cites·25 claims
- 3758US6746053B1Method and system for preventing parallel marketing of wholesale and retail itemsIBM·Filed 1998·Granted Jun 8, 2004·81 cites·13 claims
- 3854US10108762B2Tunable miniaturized physical subsurface model for simulation and inversionIBM·Filed 2014·Granted Oct 23, 2018·2 cites·18 claims
- 3954US6730618B2Low k dielectric materials with inherent copper ion migration barrierIBM·Filed 2002·Granted May 4, 2004·3 cites·8 claims
- 4054US4846929AWet etching of thermally or chemically cured polyimideIBM·Filed 1988·Granted Jul 11, 1989·20 cites·37 claims
- 4152US10766086B2Injection-molded solder (IMS) tool assembly and method of use thereofIBM·Filed 2017·Granted Sep 8, 2020·0 cites·16 claims
- 4249US7412134B2Apparatus and methods for remakeable connections to optical waveguidesIBM·Filed 2006·Granted Aug 12, 2008·0 cites·10 claims
- 4348US9962714B2Microchannel, microfluidic chip and method for processing microparticles in a fluid flowIBM·Filed 2015·Granted May 8, 2018·0 cites·20 claims
- 4448US5360946AFlex tape protective coatingIBM·Filed 1991·Granted Nov 1, 1994·13 cites·16 claims
- 4547US7951648B2Chip-level underfill method of manufactureIBM·Filed 2008·Granted May 31, 2011·0 cites·19 claims
- 4647US6414377B1Low k dielectric materials with inherent copper ion migration barrierIBM·Filed 1999·Granted Jul 2, 2002·10 cites·21 claims
- 4747US2010164030A1Chip carrier bearing large silicon for high performance computing and related methodIBM·Filed 2008·Application pending·0 cites
- 4845US8636931B2Vacuum extrusion method of manufacturing a thermal pasteFEGER CLAUDIUS·Filed 2007·Granted Jan 28, 2014·0 cites·23 claims
- 4945US6217185B1Efficient backlighting for a portable displayIBM·Filed 1999·Granted Apr 17, 2001·11 cites·12 claims
- 5045US2009102070A1Alignment Marks on the Edge of Wafers and Methods for SameIBM·Filed 2007·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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