Inventor · disambiguated record
Clifford Sandstrom
Also filed as: SANDSTROM CLIFFORD · SANDSTROM CLIFFORD P
17 granted patents·8 pending applications·25 citations·filing 2005–2025
88Inventor score
Top patents by PatentIndex Score
25 records- 0193US11616003B2Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2022·Granted Mar 28, 2023·2 cites·18 claims
- 0291US12424527B2Multi-chip or multi-chiplet fan-out device for laminate and leadframe packagesDECA TECH USA INC·Filed 2024·Granted Sep 23, 2025·1 cites·27 claims
- 0390US11444051B2Fully molded semiconductor structure with face mounted passives and method of making the sameDECA TECH USA INC·Filed 2021·Granted Sep 13, 2022·2 cites·20 claims
- 0488US11728248B2Fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 0587US7352444B1Method for arranging and rotating a semiconductor wafer within a photolithography tool prior to exposing the waferCYPRESS SEMICONDUCTOR CORP·Filed 2005·Granted Apr 1, 2008·19 cites·11 claims
- 0686US2025357351A1Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 0777US12438065B2Fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2023·Granted Oct 7, 2025·0 cites·26 claims
- 0874US12381154B2Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 0974US12300561B2Fully molded structure with multi-height components comprising backside conductive material and method for making the sameDECA TECH USA INC·Filed 2024·Granted May 13, 2025·0 cites·21 claims
- 1073US2024421051A1Multi-chip or multi-chiplet fan-out device for laminate and leadframe packagesDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 1172US2025273526A1Fully molded structure with multi-height components comprising backside conductive material and method for making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 1270US11538759B2Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2022·Granted Dec 27, 2022·0 cites·20 claims
- 1369US12057373B2Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the sameDECA TECH USA INC·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 1468US12170261B2Molded direct contact interconnect structure without capture pads and method for the sameDECA TECH USA INC·Filed 2023·Granted Dec 17, 2024·0 cites·30 claims
- 1568US11973051B2Molded direct contact interconnect structure without capture pads and method for the sameDECA TECH USA INC·Filed 2023·Granted Apr 30, 2024·0 cites·30 claims
- 1663US12506102B2Fully molded semiconductor structure with face mounted passives and method of making the sameDECA TECH USA INC·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 1763US12500197B2Encapsulant-defined land grid array (LGA) package and method for making the sameDECA TECH USA INC·Filed 2023·Granted Dec 16, 2025·0 cites·22 claims
- 1862US2024395673A1Stackable fully molded semiconductor structure with through vertical interconnectsDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 1960US2025112141A1Quad flat no-lead (qfn) package without leadframe and with layer of dielectricDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 2059US2025054785A1Method of selective release of components using thermal release layerDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 2159US2024243089A1Layered molded direct contact and dielectric structure and method for making the sameDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 2257US2024030174A1Quad flat no-lead (qfn) package with backside conductive material and direct contact interconnect build-up structure and method for making the sameDECA TECH USA INC·Filed 2023·Application pending·0 cites
- 2354US11749534B1Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the sameDECA TECH USA INC·Filed 2022·Granted Sep 5, 2023·0 cites·29 claims
- 2452US11664321B2Multi-step high aspect ratio vertical interconnect and method of making the sameDECA TECH USA INC·Filed 2022·Granted May 30, 2023·0 cites·19 claims
- 2551US12500198B2Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the sameDECA TECH USA INC·Filed 2025·Granted Dec 16, 2025·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →