Inventor · disambiguated record
Conrad Cachia
Also filed as: CACHIA CONRAD · CACHIA CONRAD MAX
7 granted patents·4 citations·filing 2007–2019
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0171US10435290B2Wafer level package for a MEMS sensor device and corresponding manufacturing processSTMICROELECTRONICS MALTA LTD·Filed 2017·Granted Oct 8, 2019·2 cites·17 claims
- 0264US9527727B2Packages for semiconductor devices and methods for assembling sameSTMICROELECTRONICS (MALTA) LTD·Filed 2014·Granted Dec 27, 2016·2 cites·21 claims
- 0355US10882738B2Wafer level package for a mems sensor device and corresponding manufacturing processSTMICROELECTRONICS MALTA LTD·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
- 0445US9802813B2Wafer level package for a MEMS sensor device and corresponding manufacturing processSTMICROELECTRONICS (MALTA) LTD·Filed 2015·Granted Oct 31, 2017·0 cites·22 claims
- 0543US8633583B2Semiconductor package substrate and methods for forming same, in particular for MEMS devicesZIGLIOLI FEDERICO GIOVANNI·Filed 2007·Granted Jan 21, 2014·0 cites·23 claims
- 0641US9290377B2Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor deviceSTMICROELECTRONICS MALTA LTD·Filed 2014·Granted Mar 22, 2016·0 cites·12 claims
- 0738US8748291B2Method for strip testing of MEMS devices, testing strip of MEMS devices and MEMS device thereofST MICROELECTRONICS SRL·Filed 2012·Granted Jun 10, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →