Inventor · disambiguated record
Collin Jordon Fleshman
Also filed as: FLESHMAN COLLIN JORDON
1 granted patent·3 pending applications·0 citations·filing 2022–2025
13Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4
Top patents by PatentIndex Score
4 records- 0177US2025349732A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0274US2025357287A1Package structure including an array of copper pillars and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0366US2023307375A1Semiconductor Package and Method of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0462US12394696B2Package structure including an array of copper pillars and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →