Inventor · disambiguated record
Courtney Furnival
Also filed as: FURNIVAL COURTNEY · FURNIVAL COURTNEY R
7 granted patents·250 citations·filing 1993–2014
88Inventor score
Top patents by PatentIndex Score
7 records- 0189US9214416B1High speed, low loss and high density power semiconductor packages (μMaxPak) with molded surface mount high speed device(s) and multi-chip architecturesFURNIVAL COURTNEY·Filed 2014·Granted Dec 15, 2015·22 cites·3 claims
- 0285US8094458B2Semiconductor package with embedded magnetic component and method of manufactureFURNIVAL COURTNEY R·Filed 2009·Granted Jan 10, 2012·21 cites·45 claims
- 0385US5408128AHigh power semiconductor device module with low thermal resistance and simplified manufacturingINT RECTIFIER CORP·Filed 1993·Granted Apr 18, 1995·96 cites·24 claims
- 0482US6147869AAdaptable planar moduleINT RECTIFIER CORP·Filed 1998·Granted Nov 14, 2000·67 cites·38 claims
- 0577US7307341B2Integrated packaged having magnetic componentsIXYS CORP·Filed 2006·Granted Dec 11, 2007·12 cites·22 claims
- 0664US5914577APower train partition for 10 horsepower motor controllerINT RECTIFIER CORP·Filed 1997·Granted Jun 22, 1999·26 cites·16 claims
- 0735US6081039APressure assembled motor cubeINT RECTIFIER CORP·Filed 1997·Granted Jun 27, 2000·6 cites·23 claims
Join the waitlist — get patent alerts
Get an alert when Courtney Furnival files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →