Inventor · disambiguated record
Colin Hatchard
Also filed as: HATCHARD COLIN · HATCHARD COLIN D
10 granted patents·1 pending application·185 citations·filing 1997–2001
91Inventor score
Files withADVANCED MICRO DEVICES INC10
Top patents by PatentIndex Score
11 records- 0173US6046507AElectrophoretic coating methodology to improve internal package delamination and wire bond reliabilityADVANCED MICRO DEVICES INC·Filed 1997·Granted Apr 4, 2000·46 cites·1 claims
- 0268US6548881B1Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit productsADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 15, 2003·17 cites·10 claims
- 0366US6395568B1Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit productsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 28, 2002·11 cites·9 claims
- 0466US6315936B1Encapsulation method using non-homogeneous molding compound pelletsADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 13, 2001·12 cites·2 claims
- 0560US6320266B1Technique for reducing breakage of thinned flip-chip multi-layer integrated circuit devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 20, 2001·22 cites·2 claims
- 0660US6091157AMethod to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pelletsADVANCED MICRO DEVICES INC·Filed 1997·Granted Jul 18, 2000·23 cites·2 claims
- 0755US6181017B1System for marking electrophoretic dies while reducing damage due to electrostatic dischargeADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 30, 2001·21 cites·13 claims
- 0853US6495393B2Method to improve chip scale package electrostatic discharge performance and suppress marking artifactsADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 17, 2002·5 cites·12 claims
- 0950US6049465ASignal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessorADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 11, 2000·25 cites·4 claims
- 1032US6331735B1Method to improve chip scale package electrostatic discharge performance and suppress marking artifactsADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 18, 2001·3 cites·2 claims
- 1129US2002046855A1Underfill removal for easing separation of an integrated circuit device and packageFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →