Inventor · disambiguated record
Cory Nelson
Also filed as: NELSON CORY · NELSON CORY ALEXANDER
14 granted patents·22 pending applications·7 citations·filing 2004–2025
84Inventor score
Files withKYOCERA AVX COMPONENTS CORP30AVX CORP2KYOCRA AVX COMPONENTS CORP2JIN SONG1QUICKSILVER SOFTWARE INC1
Top patents by PatentIndex Score
36 records- 0189US12200853B2Embeddable electrically insulating thermal connector and circuit board including the sameKYOCERA AVX COMPONENTS CORP·Filed 2022·Granted Jan 14, 2025·2 cites·23 claims
- 0289US11837405B2Multilayer ceramic capacitorKYOCERA AVX COMPONENTS CORP·Filed 2021·Granted Dec 5, 2023·3 cites·21 claims
- 0386US2025393131A1Surface Mount Radiofrequency ComponentKYOCERA AVX COMPONENTS CORP·Filed 2025·Application pending·0 cites
- 0477US2025106979A1Embeddable Electrically Insulating Thermal Connector and Circuit Board Including the SameKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 0576US11967609B2High frequency and high power thin-film componentAVX CORP·Filed 2019·Granted Apr 23, 2024·2 cites·9 claims
- 0673US12334261B2Multilayer ceramic capacitorKYOCERA AVX COMPONENTS CORP·Filed 2023·Granted Jun 17, 2025·0 cites·21 claims
- 0772US2025185154A1Transmission Line Capacitor and Circuit Board Including the Same Embedded WithinKYOCRA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 0870US12432856B2Surface mount radiofrequency componentKYOCERA AVX COMPONENTS CORP·Filed 2022·Granted Sep 30, 2025·0 cites·34 claims
- 0968US12446299B2Combined MOS/MIS capacitor assemblyKYOCERA AVX COMPONENTS CORP·Filed 2022·Granted Oct 14, 2025·0 cites·16 claims
- 1068US2025174385A1Multilayer Structure Including an Inductor and Methods for Forming a Multilayer StructureKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 1168US2025174391A1Inductor and Methods for Forming an InductorKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 1265US12177960B2High frequency and high power thin film componentKYOCERA AVX COMPONENTS CORP·Filed 2022·Granted Dec 24, 2024·0 cites·26 claims
- 1363US12213243B2Transmission line capacitor and circuit board including the same embedded withinKYOCRA AVX COMPONENTS CORP·Filed 2022·Granted Jan 28, 2025·0 cites·32 claims
- 1461US2025079321A1Vertically Oriented Interposer Stack And AssemblyKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 1561US2025167414A1Multilayer Filter, Multilayer Filter Assembly, and Methods for Forming a Multilayer FilterKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 1661US2025079419A1Vertically Oriented Component Stack And AssemblyKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 1761US2025079404A1Vertical Component Stack And AssemblyKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 1860US2025167750A1Multilayer Filter, Multilayer Filter Assembly, and Methods for Forming a Multilayer FilterKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 1960US2025174404A1Multilayer Electronic Component Including at Least One Via Connected to a Capacitor Outside Its Capacitive AreaKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 2060US2024292540A1Multicomponent ConnectorKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 2160US2024379649A1Thick Film Single Layer CapacitorKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 2257US12462983B2Embeddable semiconductor-based capacitorKYOCERA AVX COMPONENTS CORP·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 2356US11949169B2High frequency and high power thin-film componentKYOCERA AVX COMPONENTS CORP·Filed 2022·Granted Apr 2, 2024·0 cites·29 claims
- 2456US2024381537A1Plateable Single Layer CapacitorKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 2556US2024249880A1Ultrabroadband Cascade CapacitorKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 2654US2004215546A1Systems and methods for investment decision supportQUICKSILVER SOFTWARE INC·Filed 2004·Application pending·0 cites
- 2754US2024032185A1Heat Sink Component TerminationsKYOCERA AVX COMPONENTS CORP·Filed 2023·Application pending·0 cites
- 2853US2024314928A1Ultra-Thin Sandwich ComponentKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 2953US2024234591A9Metal-Oxide-Semiconductor CapacitorKYOCERA AVX COMPONENTS CORP·Filed 2023·Application pending·0 cites
- 3052US12159945B2Embeddable semiconductor-based capacitorKYOCERA AVX COMPONENTS CORP·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 3152US2024395656A1Components For Increased Power HandlingKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 3251US12080809B2Metal-oxide-semiconductor capacitor and circuit board including the same embedded thereinKYOCERA AVX COMPONENTS CORP·Filed 2022·Granted Sep 3, 2024·0 cites·19 claims
- 3351US2023070808A1Heat Sink Component With Land Grid Array ConnectionsKYOCERA AVX COMPONENTS CORP·Filed 2022·Application pending·0 cites
- 3451US2023076503A1Electronically Insulating Thermal Connector having a Low Thermal ResistivityKYOCERA AVX COMPONENTS CORP·Filed 2022·Application pending·0 cites
- 3550US8507287B2Mesoporous metal oxide materials for phosphoproteomicsJIN SONG·Filed 2009·Granted Aug 13, 2013·0 cites·24 claims
- 3648US12127384B2Filter with cover layer and shield layerAVX CORP·Filed 2021·Granted Oct 22, 2024·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →