Inventor · disambiguated record
Cory A. Runyan
Also filed as: RUNYAN CORY · RUNYAN CORY A
4 granted patents·2 pending applications·10 citations·filing 1999–2021
65Inventor score
Top patents by PatentIndex Score
6 records- 0186US9917041B13D chip assemblies using stacked leadframesINTEL CORP·Filed 2016·Granted Mar 13, 2018·6 cites·20 claims
- 0246US2018158764A13d chip assemblies using stacked leadframesINTEL CORP·Filed 2018·Application pending·0 cites
- 0345US2022115231A1Wrap-around label for ssdINTEL CORP·Filed 2021·Application pending·0 cites
- 0436US11562955B2High density multiple die structureINTEL CORP·Filed 2016·Granted Jan 24, 2023·0 cites·14 claims
- 0534US10770429B2Microelectronic device stacks having interior window wirebondingINTEL CORP·Filed 2016·Granted Sep 8, 2020·0 cites·15 claims
- 0634US6075690ARelay multiplexer system and method for improved debounce of relaysNAT INSTR CORP·Filed 1999·Granted Jun 13, 2000·4 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →