Inventor · disambiguated record
Cornelia Tsang Yang
Also filed as: TSANG YANG CORNELIA
3 granted patents·0 citations·filing 2016–2019
47Inventor score
Files withIBM3
Top patents by PatentIndex Score
3 records- 0163US10396220B2Device layer thin-film transfer to thermally conductive substrateIBM·Filed 2019·Granted Aug 27, 2019·0 cites·14 claims
- 0261US10243091B2Device layer thin-film transfer to thermally conductive substrateIBM·Filed 2018·Granted Mar 26, 2019·0 cites·10 claims
- 0343US10811305B2Wafer level integration including design/co-design, structure process, equipment stress management, and thermal managementIBM·Filed 2016·Granted Oct 20, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →