Inventor · disambiguated record
Crispulo Estira Lictao, Jr.
Also filed as: LICTAO CRISPULO · LICTAO CRISPULO E · LICTAO JR CRISPULO · LICTAO JR CRISPULO ESTIRA
5 granted patents·4 pending applications·25 citations·filing 2001–2025
72Inventor score
Top patents by PatentIndex Score
9 records- 0167US2025266335A1Semiconductor device with embedded battery and method thereforNXP USA INC·Filed 2025·Application pending·0 cites
- 0266US12406911B2Semiconductor device with embedded battery and method thereforNXP USA INC·Filed 2022·Granted Sep 2, 2025·0 cites·6 claims
- 0357US6680545B2Semiconductor devicesKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Jan 20, 2004·14 cites·12 claims
- 0457US2025338447A1Heatsink deviceNXP BV·Filed 2024·Application pending·0 cites
- 0555US7413108B2Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding toolNXP BV·Filed 2003·Granted Aug 19, 2008·11 cites·7 claims
- 0652US2025174531A1Electronic package with a battery secured by a bent leadframeNXP USA INC·Filed 2023·Application pending·0 cites
- 0750US11482478B2Shielded electronic package and method of fabricationNXP BV·Filed 2020·Granted Oct 25, 2022·0 cites·16 claims
- 0840US2008272176A1Wedge-bonding of wires in electronic device manufacture with reversible wedge bondingNXP BV·Filed 2008·Application pending·0 cites
- 0931US10297500B2Semiconductor wafer dicing methodNexperia BV·Filed 2016·Granted May 21, 2019·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →