Inventor · disambiguated record
Craig J. Rotay
Also filed as: ROTAY CRAIG J
14 granted patents·2 pending applications·56 citations·filing 1992–2016
90Inventor score
Top patents by PatentIndex Score
16 records- 0189US8153474B2Modular low stress package technologyROTAY CRAIG J·Filed 2010·Granted Apr 10, 2012·10 cites·15 claims
- 0270US8759965B2Modular low stress package technologyROTAY CRAIG J·Filed 2010·Granted Jun 24, 2014·2 cites·27 claims
- 0369US8560104B2Modular low stress package technologyROTAY CRAIG J·Filed 2010·Granted Oct 15, 2013·2 cites·18 claims
- 0469US8283769B2Modular low stress package technologyROTAY CRAIG J·Filed 2010·Granted Oct 9, 2012·2 cites·20 claims
- 0563US8639373B2Modular low stress package technologyROTAY CRAIG J·Filed 2010·Granted Jan 28, 2014·1 cites·22 claims
- 0663US7459979B2Semiconductor indicator for voltage diagnostics in power amplifiersST MICROELECTRONICS INC·Filed 2005·Granted Dec 2, 2008·5 cites·20 claims
- 0761US5422522ADevice for biasing an RF device operating in quasi-linear modes with temperature compensationSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Jun 6, 1995·21 cites·17 claims
- 0850US8980747B2Method and system for pre-migration of metal ions in a semiconductor packageST MICROELECTRONICS INC·Filed 2013·Granted Mar 17, 2015·0 cites·18 claims
- 0947US5457422ADevice for biasing an RF device operating in quasi-linear modes with voltage compensationSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Oct 10, 1995·8 cites·9 claims
- 1045US9917040B1Stress relieved thermal base for integrated circuit packagingST MICROELECTRONICS INC·Filed 2016·Granted Mar 13, 2018·0 cites·20 claims
- 1144US8557703B2Method for pre-migration of metal ions in a semiconductor packageROTAY CRAIG J·Filed 2010·Granted Oct 15, 2013·0 cites·15 claims
- 1243US8853843B2Modular low stress package technologyROTAY CRAIG J·Filed 2012·Granted Oct 7, 2014·0 cites·29 claims
- 1340US8597984B2Modular low stress package technologyROTAY CRAIG J·Filed 2012·Granted Dec 3, 2013·0 cites·18 claims
- 1439US2006255455A1Reliability and improved frequency response package for extremely high power density transistorsST MICROELECTRONICS INC·Filed 2005·Application pending·0 cites
- 1538US2012158166A1Modular low stress package technologyROTAY CRAIG J·Filed 2012·Application pending·0 cites
- 1628US5532639AMethod and structure for improving RF amplifier gain, linearity, and switching speed utilizing Schottky diode technologySGS THOMSON MICROELECTRONICS·Filed 1994·Granted Jul 2, 1996·5 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →