Inventor · disambiguated record
Curtis Miller
Also filed as: MILLER CURTIS · MILLER CURTIS J · MILLER CURTIS JAMES
5 granted patents·8 citations·filing 2004–2021
70Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0150US8025201B2Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profilesAGERE SYSTEMS INC·Filed 2006·Granted Sep 27, 2011·1 cites·21 claims
- 0249US7075174B2Semiconductor packaging techniques for use with non-ceramic packagesAGERE SYSTEMS INC·Filed 2004·Granted Jul 11, 2006·4 cites·20 claims
- 0347US7977804B2Ball-bump bonded ribbon-wire interconnectTEKTRONIX INC·Filed 2008·Granted Jul 12, 2011·1 cites·27 claims
- 0443US12136615B2Electronic package with interposer between integrated circuit diesQORVO US INC·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 0539US7074705B2Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profilesAGERE SYSTEMS INC·Filed 2004·Granted Jul 11, 2006·2 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →