Inventor · disambiguated record
Cyril Buttay
Also filed as: BUTTAY CYRIL
3 granted patents·74 citations·filing 2006–2018
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0194US7999369B2Power electronic package having two substrates with multiple semiconductor chips and electronic componentsDENSO CORP·Filed 2006·Granted Aug 16, 2011·62 cites·26 claims
- 0287US8432030B2Power electronic package having two substrates with multiple semiconductor chips and electronic componentsMALHAN RAJESH KUMAR·Filed 2011·Granted Apr 30, 2013·12 cites·5 claims
- 0340US11049795B2Electronic power module comprising a dielectric supportINST SUPERGRID·Filed 2018·Granted Jun 29, 2021·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →