Inventor · disambiguated record
Cyriac Devasia
Also filed as: DEVASIA CYRIAC
5 granted patents·3 pending applications·74 citations·filing 1997–2021
78Inventor score
Top patents by PatentIndex Score
8 records- 0185US11791197B2Die bonding system with wafer lift and level assemblyMRSI SYSTEMS LLC·Filed 2021·Granted Oct 17, 2023·2 cites·17 claims
- 0269US6389688B1Method and apparatus for chip placementMICRO ROBOTICS SYSTEMS INC·Filed 1997·Granted May 21, 2002·49 cites·22 claims
- 0367US9911710B2Thermo-compression bonding system, subsystems, and methods of useMRSI SYSTEMS LLC·Filed 2014·Granted Mar 6, 2018·4 cites·4 claims
- 0459US6220487B1Dispensing apparatusMICRO ROBOTICS SYSTEMS INC·Filed 1999·Granted Apr 24, 2001·19 cites·19 claims
- 0551US12237202B2Die bonding system with heated automatic collet changerMRSI SYSTEMS LLC·Filed 2020·Granted Feb 25, 2025·0 cites·16 claims
- 0636US2005072815A1Apparatus for dispensing precise amounts of a non-compressible fluidFiled 2003·Application pending·0 cites
- 0734US2005045914A1Flip chip device assembly machineNEWPORT CORP·Filed 2004·Application pending·0 cites
- 0826US2015380379A1System and method for thermo-compression bonding of high bump count semiconductorsMRSI SYSTEMS LLC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →