Inventor · disambiguated record
David H. Altman
Also filed as: ALTMAN DAVID · ALTMAN DAVID H
18 granted patents·1 pending application·110 citations·filing 2007–2020
93Inventor score
Top patents by PatentIndex Score
19 records- 0194US8797741B2Maintaining thermal uniformity in micro-channel cold plates with two-phase flowsALTMAN DAVID H·Filed 2010·Granted Aug 5, 2014·28 cites·20 claims
- 0293US9502330B1Coolant distribution structure for monolithic microwave integrated circuits (MMICs)RAYTHEON CO·Filed 2015·Granted Nov 22, 2016·12 cites·18 claims
- 0391US8987892B2Method for creating a selective solder seal interface for an integrated circuit cooling systemRAYTHEON CO·Filed 2013·Granted Mar 24, 2015·14 cites·14 claims
- 0487US9318450B1Patterned conductive epoxy heat-sink attachment in a monolithic microwave integrated circuit (MMIC)RAYTHEON CO·Filed 2014·Granted Apr 19, 2016·10 cites·7 claims
- 0586US11558957B2Shape memory thermal capacitor and methods for sameRAYTHEON CO·Filed 2020·Granted Jan 17, 2023·3 cites·23 claims
- 0682US10766097B2Integration of ultrasonic additive manufactured thermal structures in brazementsRAYTHEON CO·Filed 2017·Granted Sep 8, 2020·2 cites·8 claims
- 0782US8106510B2Nano-tube thermal interface structureALTMAN DAVID H·Filed 2009·Granted Jan 31, 2012·13 cites·13 claims
- 0880US11476178B2Selectively-pliable chemical vapor deposition (CVD) diamond or other heat spreaderRAYTHEON CO·Filed 2020·Granted Oct 18, 2022·1 cites·20 claims
- 0979US10018428B2Method and apparatus for heat spreaders having a vapor chamber with a wick structure to promote incipient boilingALTMAN DAVID H·Filed 2011·Granted Jul 10, 2018·4 cites·13 claims
- 1079US7548424B2Distributed transmit/receive integrated microwave module chip level cooling systemRAYTHEON CO·Filed 2007·Granted Jun 16, 2009·12 cites·11 claims
- 1176US8839519B2Method of making cold chassis for electronic modulesALTMAN DAVID H·Filed 2009·Granted Sep 23, 2014·6 cites·20 claims
- 1270US10267569B2Thermal storage heat exchanger structures employing phase change materialsRAYTHEON CO·Filed 2016·Granted Apr 23, 2019·1 cites·20 claims
- 1366US10436522B2Thermal storage heat exchanger structures employing phase change materialsRAYTHEON CO·Filed 2016·Granted Oct 8, 2019·1 cites·20 claims
- 1464US8809208B2Nano-tube thermal interface structureALTMAN DAVID H·Filed 2011·Granted Aug 19, 2014·2 cites·3 claims
- 1563US11063435B2Energy-based adaptive stability control systemRAYTHEON CO·Filed 2018·Granted Jul 13, 2021·1 cites·17 claims
- 1654US11349292B2Arc flash protection of power systemsRAYTHEON CO·Filed 2019·Granted May 31, 2022·0 cites·18 claims
- 1753US9526192B2Cold chassis for electronic modules and method of making sameRAYTHEON CO·Filed 2014·Granted Dec 20, 2016·0 cites·20 claims
- 1839US2010038056A1High performance compact heat exchangerELLSWORTH JOSEPH R·Filed 2008·Application pending·0 cites
- 1932US8044869B2Stealth wireless communications facilityCELLBOAT COMPANY LLC·Filed 2009·Granted Oct 25, 2011·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →