Inventor · disambiguated record
Daniel Arnzen
Also filed as: ARNZEN DANIEL · ARNZEN DANIEL J
6 granted patents·163 citations·filing 1996–2006
86Inventor score
Files withCYPRESS SEMICONDUCTOR CORP6
Top patents by PatentIndex Score
6 records- 0196US7507944B1Non-planar packaging of image sensorCYPRESS SEMICONDUCTOR CORP·Filed 2006·Granted Mar 24, 2009·52 cites·20 claims
- 0275US6016012AThin liner layer providing reduced via resistanceCYPRESS SEMICONDUCTOR CORP·Filed 1996·Granted Jan 18, 2000·56 cites·24 claims
- 0373US6833622B1Semiconductor topography having an inactive region formed from a dummy structure patternCYPRESS SEMICONDUCTOR CORP·Filed 2003·Granted Dec 21, 2004·17 cites·20 claims
- 0471US7129178B1Reducing defect formation within an etched semiconductor topographyCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Oct 31, 2006·17 cites·11 claims
- 0565US6406640B1Plasma etching methodCYPRESS SEMICONDUCTOR CORP·Filed 2000·Granted Jun 18, 2002·9 cites·14 claims
- 0647US6165375APlasma etching methodCYPRESS SEMICONDUCTOR CORP·Filed 1997·Granted Dec 26, 2000·12 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →