Inventor · disambiguated record
Dan Azeroual
Also filed as: AZEROUAL DAN
13 granted patents·1 pending application·54 citations·filing 2007–2023
88Inventor score
Top patents by PatentIndex Score
14 records- 0191US11917749B1Integrated circuit package differential pin pattern for cross-talk reductionMARVELL ISRAEL MISL LTD·Filed 2022·Granted Feb 27, 2024·2 cites·21 claims
- 0291US9089060B1Ball-out for differential signalsAZEROUAL DAN·Filed 2011·Granted Jul 21, 2015·20 cites·19 claims
- 0386US12295094B1Pad and via pattern arrangement for differential signal shieldingMARVELL ISRAEL MISL LTD·Filed 2022·Granted May 6, 2025·1 cites·16 claims
- 0485US9565762B1Power delivery network in a printed circuit board structureMARVELL ISRAEL (M I S L) LTD·Filed 2014·Granted Feb 7, 2017·10 cites·22 claims
- 0581US7838778B1Circuit board layoutMARVELL ISRAEL MISL LTD·Filed 2007·Granted Nov 23, 2010·12 cites·25 claims
- 0679US11581292B2IC package with top-side memory moduleMARVELL ISRAEL MISL LTD·Filed 2020·Granted Feb 14, 2023·1 cites·12 claims
- 0771US8803339B1Bump out for differential signalsAZEROUAL DAN·Filed 2011·Granted Aug 12, 2014·4 cites·7 claims
- 0869US11088123B1Package system having laterally offset and ovelapping chip packagesMARVELL ISRAEL MISL LTD·Filed 2019·Granted Aug 10, 2021·2 cites·26 claims
- 0967US11967587B2IC package with top-side memory moduleMARVELL ISRAEL MISL LTD·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
- 1053US8164348B1Method and apparatus for tuning delayAZEROUAL DAN·Filed 2009·Granted Apr 24, 2012·2 cites·12 claims
- 1147US11004778B1Polygonal BGA semiconductor packageMARVELL ISRAEL MISL LTD·Filed 2019·Granted May 11, 2021·0 cites·22 claims
- 1242US9083348B1Method and apparatus for tuning delayAZEROUAL DAN·Filed 2012·Granted Jul 14, 2015·0 cites·6 claims
- 1341US11508663B2PCB module on packageMARVELL ISRAEL MISL LTD·Filed 2019·Granted Nov 22, 2022·0 cites·20 claims
- 1437US2019051587A1Ic packageMARVELL ISRAEL MISL LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →