Inventor · disambiguated record
David Francis Berdy
Also filed as: BERDY DAVID · BERDY DAVID F · BERDY DAVID FRANCIS
57 granted patents·17 pending applications·163 citations·filing 2013–2023
98Inventor score
Top patents by PatentIndex Score
74 records- 0197US9807882B1Density-optimized module-level inductor ground structureQUALCOMM INC·Filed 2016·Granted Oct 31, 2017·21 cites·20 claims
- 0296US9502586B1Backside coupled symmetric varactor structureQUALCOMM INC·Filed 2015·Granted Nov 22, 2016·13 cites·18 claims
- 0395US9893048B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2015·Granted Feb 13, 2018·7 cites·30 claims
- 0494US10283257B2Skewed co-spiral inductor structureQUALCOMM INC·Filed 2016·Granted May 7, 2019·12 cites·25 claims
- 0594US10242957B2Compartment shielding in flip-chip (FC) moduleQUALCOMM INC·Filed 2015·Granted Mar 26, 2019·13 cites·30 claims
- 0694US9959964B2Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 1, 2018·6 cites·25 claims
- 0793US9721946B2Backside coupled symmetric varactor structureQUALCOMM INC·Filed 2016·Granted Aug 1, 2017·7 cites·10 claims
- 0893US9620463B2Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)QUALCOMM INC·Filed 2015·Granted Apr 11, 2017·10 cites·29 claims
- 0987US10290414B2Substrate comprising an embedded inductor and a thin film magnetic coreQUALCOMM INC·Filed 2015·Granted May 14, 2019·6 cites·20 claims
- 1087US9203373B2Diplexer design using through glass via technologyQUALCOMM INC·Filed 2013·Granted Dec 1, 2015·8 cites·20 claims
- 1186US10069474B2Encapsulation of acoustic resonator devicesQUALCOMM INC·Filed 2016·Granted Sep 4, 2018·4 cites·30 claims
- 1285US9954267B2Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filterQUALCOMM INC·Filed 2016·Granted Apr 24, 2018·4 cites·25 claims
- 1384US9875848B2MIM capacitor and method of making the sameQUALCOMM INC·Filed 2015·Granted Jan 23, 2018·4 cites·30 claims
- 1483US10163771B2Interposer device including at least one transistor and at least one through-substrate viaQUALCOMM INC·Filed 2016·Granted Dec 25, 2018·4 cites·22 claims
- 1583US9813043B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2016·Granted Nov 7, 2017·3 cites·23 claims
- 1683US9768109B2Integrated circuits (ICS) on a glass substrateQUALCOMM INC·Filed 2015·Granted Sep 19, 2017·3 cites·20 claims
- 1783US9275786B2Superposed structure 3D orthogonal through substrate inductorQUALCOMM INC·Filed 2014·Granted Mar 1, 2016·5 cites·23 claims
- 1882US9966426B2Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 8, 2018·4 cites·20 claims
- 1981US10103135B2Backside ground plane for integrated circuitQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·3 cites·19 claims
- 2080US9660110B2Varactor device with backside contactQUALCOMM INC·Filed 2014·Granted May 23, 2017·3 cites·30 claims
- 2177US10044390B2Glass substrate including passive-on-glass device and semiconductor dieQUALCOMM INC·Filed 2016·Granted Aug 7, 2018·2 cites·17 claims
- 2276US9930783B2Passive device assembly for accurate ground plane controlQUALCOMM INC·Filed 2016·Granted Mar 27, 2018·2 cites·37 claims
- 2376US9906318B2Frequency multiplexerQUALCOMM INC·Filed 2015·Granted Feb 27, 2018·3 cites·24 claims
- 2475US9634640B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2013·Granted Apr 25, 2017·3 cites·19 claims
- 2571US10498307B2Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductorQUALCOMM INC·Filed 2017·Granted Dec 3, 2019·1 cites·24 claims
- 2671US10171112B2RF multiplexer with integrated directional couplersQUALCOMM INC·Filed 2016·Granted Jan 1, 2019·2 cites·16 claims
- 2769US9136574B2Compact 3-D coplanar transmission linesQUALCOMM MEMS TECHNOLOGIES INC·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 2868US10038422B2Single-chip multi-frequency film bulk acoustic-wave resonatorsQUALCOMM INC·Filed 2016·Granted Jul 31, 2018·1 cites·20 claims
- 2967US9780048B1Side-assembled passive devicesQUALCOMM INC·Filed 2016·Granted Oct 3, 2017·1 cites·20 claims
- 3066US9666362B2Superposed structure 3D orthogonal through substrate inductorQUALCOMM INC·Filed 2016·Granted May 30, 2017·1 cites·7 claims
- 3165US10249580B2Stacked substrate inductorQUALCOMM INC·Filed 2016·Granted Apr 2, 2019·1 cites·28 claims
- 3265US9876513B2LC filter layer stacking by layer transfer to make 3D multiplexer structuresQUALCOMM INC·Filed 2016·Granted Jan 23, 2018·1 cites·24 claims
- 3364US10103116B2Open-passivation ball grid array padsQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·1 cites·18 claims
- 3463US10607980B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2018·Granted Mar 31, 2020·0 cites·20 claims
- 3563US10074625B2Wafer level package (WLP) ball support using cavity structureQUALCOMM INC·Filed 2015·Granted Sep 11, 2018·1 cites·18 claims
- 3663US9202789B2Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die packageQUALCOMM INC·Filed 2014·Granted Dec 1, 2015·1 cites·34 claims
- 3761US12476660B2System and method to reduce unwanted receive signal leakage during switchingQUALCOMM INC·Filed 2023·Granted Nov 18, 2025·0 cites·30 claims
- 3861US10903240B2Integrated circuits (ICs) on a glass substrateQUALCOMM INC·Filed 2019·Granted Jan 26, 2021·0 cites·15 claims
- 3958US10523253B2Glass substrate including passive-on-glass device and semiconductor dieQUALCOMM INC·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 4056US10332911B2Integrated circuits (ICs) on a glass substrateQUALCOMM INC·Filed 2016·Granted Jun 25, 2019·0 cites·9 claims
- 4155US10154591B2Passive device assembly for accurate ground plane controlQUALCOMM INC·Filed 2018·Granted Dec 11, 2018·0 cites·20 claims
- 4254US10141908B2Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performanceQUALCOMM INC·Filed 2016·Granted Nov 27, 2018·0 cites·21 claims
- 4352US2016181233A1Metal-insulator-metal (mim) capacitors arranged in a pattern to reduce inductance, and related methodsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4451US9560745B2Devices and methods to reduce stress in an electronic deviceQUALCOMM INC·Filed 2014·Granted Jan 31, 2017·0 cites·30 claims
- 4550US10944379B2Hybrid passive-on-glass (POG) acoustic filterQUALCOMM INC·Filed 2016·Granted Mar 9, 2021·0 cites·19 claims
- 4649US12267099B2Dynamic radio frequency loading change mitigationQUALCOMM INC·Filed 2022·Granted Apr 1, 2025·0 cites·17 claims
- 4749US10103703B2Double-sided circuitQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·0 cites·20 claims
- 4849US9343403B2Stress mitigation structure for wafer warpage reductionQUALCOMM INC·Filed 2014·Granted May 17, 2016·0 cites·10 claims
- 4948US10332671B2Solenoid inductorQUALCOMM INC·Filed 2016·Granted Jun 25, 2019·0 cites·26 claims
- 5048US10026546B2Apparatus with 3D wirewound inductor integrated within a substrateQUALCOMM INC·Filed 2016·Granted Jul 17, 2018·0 cites·28 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →