Inventor · disambiguated record
David Boggs
Also filed as: BOGGS DAVID · BOGGS DAVID W
19 granted patents·6 pending applications·532 citations·filing 1988–2023
95Inventor score
Top patents by PatentIndex Score
25 records- 0197US6787443B1PCB design and method for providing vented blind viasINTEL CORP·Filed 2003·Granted Sep 7, 2004·139 cites·6 claims
- 0296US4935584AMethod of fabricating a printed circuit board and the PCB producedTEKTRONIX INC·Filed 1988·Granted Jun 19, 1990·124 cites·15 claims
- 0392US6580174B2Vented vias for via in pad technology yield improvementsINTEL CORP·Filed 2001·Granted Jun 17, 2003·84 cites·13 claims
- 0491US11308113B1System and method for managing cognate specifications of goodsEDGEWOOD SOFTWARE CORP·Filed 2020·Granted Apr 19, 2022·5 cites·30 claims
- 0583US7583513B2Apparatus for providing an integrated printed circuit board registration couponINTEL CORP·Filed 2003·Granted Sep 1, 2009·31 cites·11 claims
- 0683US6941537B2Standoff devices and methods of using sameINTEL CORP·Filed 2002·Granted Sep 6, 2005·31 cites·63 claims
- 0782US11847129B2System and method for managing cognate specifications of goodsEDGEWOOD SOFTWARE CORP·Filed 2022·Granted Dec 19, 2023·1 cites·19 claims
- 0880US7061095B2Printed circuit board conductor channelingINTEL CORP·Filed 2001·Granted Jun 13, 2006·27 cites·17 claims
- 0978US7325303B2Three-dimensional flexible interposerINTEL CORP·Filed 2006·Granted Feb 5, 2008·15 cites·19 claims
- 1077US6641402B2Method and apparatus for training memoryFiled 2002·Granted Nov 4, 2003·20 cites·9 claims
- 1175US12158891B2System and method for managing cognate specifications of goodsEDGEWOOD SOFTWARE CORP·Filed 2023·Granted Dec 3, 2024·0 cites·11 claims
- 1273US7385288B2Electronic packaging using conductive interproser connectorINTEL CORP·Filed 2007·Granted Jun 10, 2008·5 cites·8 claims
- 1369US7084354B2PCB method and apparatus for producing landless interconnectsINTEL CORP·Filed 2002·Granted Aug 1, 2006·14 cites·26 claims
- 1467US7201583B2Three-dimensional flexible interposerINTEL CORP·Filed 2003·Granted Apr 10, 2007·14 cites·19 claims
- 1558US6667090B2Coupon registration mechanism and methodINTEL CORP·Filed 2001·Granted Dec 23, 2003·7 cites·26 claims
- 1655US7061116B2Arrangement of vias in a substrate to support a ball grid arrayINTEL CORP·Filed 2001·Granted Jun 13, 2006·6 cites·3 claims
- 1752US8199922B2Ethernet isolator for microphonics security and method thereofRENDER DAVID S J·Filed 2008·Granted Jun 12, 2012·1 cites·11 claims
- 1851US7241680B2Electronic packaging using conductive interposer connectorINTEL CORP·Filed 2004·Granted Jul 10, 2007·4 cites·7 claims
- 1949US7147141B2Preconditioning via plug material for a via-in-pad ball grid array packageINTEL CORP·Filed 2002·Granted Dec 12, 2006·4 cites·17 claims
- 2049US2003170598A1Computer assisted method for memory trainingFiled 2002·Application pending·0 cites
- 2143US2004231886A1PCB design and method for providing vented blind viasFiled 2004·Application pending·0 cites
- 2241US2012201398A1Ethernet isolator for microphonics security and method thereofRENDER DAVID S J·Filed 2012·Application pending·0 cites
- 2341US2012219145A1Ethernet isolator for microphonics security and method thereofRENDER DAVID S J·Filed 2012·Application pending·0 cites
- 2439US2004219342A1Electronic substrate with direct inner layer component interconnectionFiled 2003·Application pending·0 cites
- 2536US2004129453A1Electronic substrate with direct inner layer component interconnectionFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →