Inventor · disambiguated record
David M. Boulin
Also filed as: BOULIN DAVID M
6 granted patents·2 pending applications·93 citations·filing 1980–2008
84Inventor score
Top patents by PatentIndex Score
8 records- 0182US4386459AElectrical measurement of level-to-level misalignment in integrated circuitsBELL TELEPHONE LABOR INC·Filed 1980·Granted Jun 7, 1983·57 cites·4 claims
- 0279US7566953B2Leadframe designs for plastic overmold packagesAGERE SYSTEMS INC·Filed 2008·Granted Jul 28, 2009·7 cites·10 claims
- 0364US6977128B2Multi-layered semiconductor structureAGERE SYSTEMS INC·Filed 2003·Granted Dec 20, 2005·9 cites·19 claims
- 0462US8358005B2Packaged gallium nitride material transistors and methods associated with the sameINT RECTIFIER CORP·Filed 2008·Granted Jan 22, 2013·2 cites·15 claims
- 0552US6706609B2Method of forming an alignment feature in or on a multi-layered semiconductor structureAGERE SYSTEMS INC·Filed 2001·Granted Mar 16, 2004·4 cites·19 claims
- 0652US6576529B1Method of forming an alignment feature in or on a multilayered semiconductor structureAGERE SYSTEMS INC·Filed 1999·Granted Jun 10, 2003·14 cites·6 claims
- 0747US2006237826A1Leadframe designs for plastic overmold packagesBOULIN DAVID M·Filed 2006·Application pending·0 cites
- 0840US2006055063A1Leadframe designs for plastic overmold packagesBOULIN DAVID M·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →