Inventor · disambiguated record
David Chau
Also filed as: CHAU DAVID · CHAU DAVID S
10 granted patents·1 pending application·104 citations·filing 2003–2013
88Inventor score
Top patents by PatentIndex Score
11 records- 0196US7336487B1Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolantINTEL CORP·Filed 2006·Granted Feb 26, 2008·50 cites·31 claims
- 0284US7739876B2Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulatorINTEL CORP·Filed 2006·Granted Jun 22, 2010·10 cites·14 claims
- 0381US7915081B2Flexible interconnect pattern on semiconductor packageINTEL CORP·Filed 2006·Granted Mar 29, 2011·9 cites·11 claims
- 0477US6868898B2Heat pipe having an inner retaining wall for wicking componentsINTEL CORP·Filed 2003·Granted Mar 22, 2005·22 cites·28 claims
- 0570US8409924B2Flexible interconnect pattern on semiconductor packageTOMITA YOSHIHIRO·Filed 2012·Granted Apr 2, 2013·2 cites·12 claims
- 0662US8227907B2Flexible interconnect pattern on semiconductor packageTOMITA YOSHIHIRO·Filed 2011·Granted Jul 24, 2012·1 cites·15 claims
- 0762US7430870B2Localized microelectronic coolingINTEL CORP·Filed 2005·Granted Oct 7, 2008·2 cites·31 claims
- 0851US8518750B2Flexible interconnect pattern on semiconductor packageTOMITA YOSHIHIRO·Filed 2013·Granted Aug 27, 2013·0 cites·6 claims
- 0950US7560640B2Densely packed thermoelectric coolerINTEL CORP·Filed 2004·Granted Jul 14, 2009·4 cites·19 claims
- 1047US7211890B2Integrating thermoelectric elements into wafer for heat extractionINTEL CORP·Filed 2003·Granted May 1, 2007·4 cites·18 claims
- 1147US2009109619A1Method apparatus for cooling system having an s-shaped air flow path for use in a chassisMOTOROLA INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →