Inventor · disambiguated record
Dayoung Cho
Also filed as: CHO DAYOUNG
0 granted patents·4 pending applications·0 citations·filing 2024–2024
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0159US2025357413A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0258US2024355678A1Methods of dicing wafers having arrays of semiconductor chips therein and semiconductor chips formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0358US2025125197A1Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0456US2025046747A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Dayoung Cho files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →