Inventor · disambiguated record
Dale W. Collins
Also filed as: COLLINS DALE · COLLINS DALE W
55 granted patents·5 pending applications·196 citations·filing 2001–2024
98Inventor score
Top patents by PatentIndex Score
60 records- 0196US10008665B1Doping of selector and storage materials of a memory cellINTEL CORP·Filed 2016·Granted Jun 26, 2018·24 cites·17 claims
- 0295US10256406B2Semiconductor structures including liners and related methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Apr 9, 2019·12 cites·21 claims
- 0395US9419212B2Barrier film techniques and configurations for phase-change memory elementsINTEL CORP·Filed 2014·Granted Aug 16, 2016·20 cites·20 claims
- 0489US7935242B2Method of selectively removing conductive materialMICRON TECHNOLOGY INC·Filed 2006·Granted May 3, 2011·13 cites·37 claims
- 0585US9209388B2Memory cells and methods of forming memory cellsMICRON TECHNOLOGY INC·Filed 2013·Granted Dec 8, 2015·4 cites·29 claims
- 0683US10680175B1Memory structures having improved write enduranceINTEL CORP·Filed 2018·Granted Jun 9, 2020·3 cites·27 claims
- 0783US6723219B2Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewithMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 20, 2004·27 cites·28 claims
- 0881US11515204B2Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 29, 2022·1 cites·25 claims
- 0981US9553264B2Memory cells and semiconductor structures including electrodes comprising a metal, and related methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 24, 2017·3 cites·18 claims
- 1080US12387981B2Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1180US11038107B2Semiconductor devices including liners, and related systemsMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 15, 2021·2 cites·23 claims
- 1280US7192495B1Intermediate anneal for metal depositionMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 20, 2007·20 cites·16 claims
- 1380US7105921B2Semiconductor assemblies having electrophoretically insulated viasMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 12, 2006·4 cites·13 claims
- 1480US7105437B2Methods for creating electrophoretically insulated vias in semiconductive substratesMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 12, 2006·4 cites·20 claims
- 1579US2024292766A1Chalcogenide memory device compositionsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1678US10090462B2Resistive memory devicesMICRON TECHNOLOGY INC·Filed 2015·Granted Oct 2, 2018·2 cites·15 claims
- 1778US7179361B2Method of forming a mass over a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 20, 2007·3 cites·20 claims
- 1878US6984301B2Methods of forming capacitor constructionsMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 10, 2006·12 cites·14 claims
- 1977US11659778B2Composite electrode material chemistryMICRON TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·1 cites·7 claims
- 2077US10930849B2Techniques for forming memory structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 23, 2021·1 cites·25 claims
- 2177US9224945B2Resistive memory devicesRAMASWAMY DURAI VISHAK NIRMAL·Filed 2012·Granted Dec 29, 2015·3 cites·13 claims
- 2277US8637846B1Semiconductor structure including a zirconium oxide materialCOLLINS DALE W·Filed 2012·Granted Jan 28, 2014·3 cites·26 claims
- 2376US11195998B2Memory structures having improved write enduranceINTEL CORP·Filed 2020·Granted Dec 7, 2021·1 cites·18 claims
- 2476US7030010B2Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structuresMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 18, 2006·12 cites·87 claims
- 2574US11997937B2Chalcogenide memory device compositionsMICRON TECHNOLOGY INC·Filed 2022·Granted May 28, 2024·0 cites·25 claims
- 2674US11990370B2Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 2773US9431606B1Memory cellsMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 30, 2016·2 cites·6 claims
- 2873US7498670B2Semiconductor structures having electrophoretically insulated viasMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 3, 2009·2 cites·15 claims
- 2972US9048415B2Memory cells including top electrodes comprising metal silicide, apparatuses including such cells, and related methodsCOLLINS DALE W·Filed 2012·Granted Jun 2, 2015·2 cites·25 claims
- 3071US10347831B2Doping of selector and storage materials of a memory cellINTEL CORP·Filed 2018·Granted Jul 9, 2019·2 cites·16 claims
- 3167US11575085B2Techniques for forming memory structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 3267US9177917B2Semiconductor constructionsCOLLINS DALE W·Filed 2010·Granted Nov 3, 2015·2 cites·4 claims
- 3361US7098128B2Method for filling electrically different featuresMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 29, 2006·8 cites·58 claims
- 3457US9006702B2Semiconductor structure including a zirconium oxide materialMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 14, 2015·0 cites·20 claims
- 3556US11641788B2Resistive interface materialMICRON TECHNOLOGY INC·Filed 2020·Granted May 2, 2023·0 cites·25 claims
- 3656US10879113B2Semiconductor constructions; and methods for providing electrically conductive material within openingsMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 29, 2020·0 cites·11 claims
- 3755US7335981B2Methods for creating electrophoretically insulated vias in semiconductive substratesMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 26, 2008·0 cites·9 claims
- 3854US7375014B2Methods of electrochemically treating semiconductor substratesMICRON TECHNOLOGY INC·Filed 2005·Granted May 20, 2008·0 cites·19 claims
- 3954US7344977B2Method of electroplating a substance over a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 18, 2008·0 cites·35 claims
- 4054US7282131B2Methods of electrochemically treating semiconductor substratesMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 16, 2007·0 cites·6 claims
- 4154US7273778B2Method of electroplating a substance over a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 25, 2007·0 cites·18 claims
- 4254US7179716B2Method of forming a metal-containing layer over selected regions of a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 20, 2007·0 cites·35 claims
- 4353US9444042B2Memory cells and methods of forming memory cellsMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 13, 2016·0 cites·21 claims
- 4453US7348234B2Methods of forming capacitor constructionsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 25, 2008·0 cites·19 claims
- 4553US7025866B2Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpiecesMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 11, 2006·3 cites·40 claims
- 4652US7700478B2Intermediate anneal for metal depositionMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 20, 2010·0 cites·27 claims
- 4751US2024045604A1Self-aligned techniques for forming connections in a memory deviceMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4851US2014268991A1Chalcogenide material and methods for forming and operating devices incorporating the sameMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 4950US10121697B2Semiconductor constructions; and methods for providing electrically conductive material within openingsMICRON TECHNOLOGY INC·Filed 2015·Granted Nov 6, 2018·0 cites·10 claims
- 5048US2015056798A1Methods of forming metal oxideMICRON TECHNOLOGY INC·Filed 2014·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →