Inventor · disambiguated record
David Craig
Also filed as: CRAIG DAVID · CRAIG DAVID M · CRAIG DAVID MUIR
16 granted patents·5 pending applications·262 citations·filing 2003–2024
92Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO8INTEL CORP7PRATT & WHITNEY CANADA2ALBERTSON TODD P1CHEN CHIEN-HUA1
Top patents by PatentIndex Score
21 records- 0198US7576439B2Electrically connecting substrate with electrical deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Aug 18, 2009·109 cites·17 claims
- 0297US7476608B2Electrically connecting substrate with electrical deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jan 13, 2009·105 cites·12 claims
- 0396US11527501B1Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 13, 2022·7 cites·11 claims
- 0487US7307773B2Micro-optoelectromechanical system packages for a light modulator and methods of making the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Dec 11, 2007·10 cites·62 claims
- 0586US11622466B2Low force liquid metal interconnect solutionsINTEL CORP·Filed 2020·Granted Apr 4, 2023·2 cites·21 claims
- 0673US12349303B2Low force liquid metal interconnect solutionsINTEL CORP·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0767US9977054B2Etching for probe wire tips for microelectronic device testINTEL CORP·Filed 2015·Granted May 22, 2018·1 cites·21 claims
- 0866US11749628B2Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2022·Granted Sep 5, 2023·0 cites·15 claims
- 0966US7262498B2Assembly with a ring and bonding pads formed of a same material on a substrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Aug 28, 2007·2 cites·20 claims
- 1065US11340258B2Probe pins with etched tips for electrical die testINTEL CORP·Filed 2020·Granted May 24, 2022·0 cites·18 claims
- 1161US7541209B2Method of forming a device package having edge interconnect padHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jun 2, 2009·1 cites·11 claims
- 1261US6917099B2Die carrier with fluid chamberHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 12, 2005·13 cites·39 claims
- 1357US7300812B2Micro electrical mechanical systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Nov 27, 2007·8 cites·14 claims
- 1455US7019886B2Light modulatorHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 28, 2006·4 cites·36 claims
- 1554US10598696B2Probe pins with etched tips for electrical die testINTEL CORP·Filed 2016·Granted Mar 24, 2020·0 cites·20 claims
- 1654US2025297922A1System and method for estimating a service life of a component of an aircraft power plantPRATT & WHITNEY CANADA·Filed 2024·Application pending·0 cites
- 1754US2025252033A1Ai model for component health assessment using non-destructive testing dataPRATT & WHITNEY CANADA·Filed 2024·Application pending·0 cites
- 1848US8497577B2Micro electrical mechanical systemCHEN CHIEN-HUA·Filed 2007·Granted Jul 30, 2013·0 cites·3 claims
- 1944US2009246603A1Process for reclaiming a contaminated electrolyte from an electrolytic cell used in the production of gaseous fluorineHONEYWELL INC·Filed 2008·Application pending·0 cites
- 2039US2005077342A1Securing a cover for a deviceFiled 2003·Application pending·0 cites
- 2129US2013269173A1Apparatus and method for automated sort probe assembly and repairALBERTSON TODD P·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →