Inventor · disambiguated record
Dan Cromwell
Also filed as: CROMWELL DAN
4 granted patents·65 citations·filing 2002–2003
78Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO4
Top patents by PatentIndex Score
4 records- 0174US7372147B2Supporting a circuit package including a substrate having a solder column arrayHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted May 13, 2008·28 cites·13 claims
- 0267US6660563B1Method and system for assembling a printed circuit board using a land grid arrayHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Dec 9, 2003·14 cites·18 claims
- 0366US6923658B2Support for an integrated circuit package having a column grid array interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Aug 2, 2005·14 cites·19 claims
- 0460US7171742B2Method and system for assembling a printed circuit board using a land grid arrayHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Feb 6, 2007·9 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →