Inventor · disambiguated record
David Crouthamel
Also filed as: CROUTHAMEL DAVID · CROUTHAMEL DAVID L · CROUTHAMEL DAVID LEE
3 granted patents·2 pending applications·14 citations·filing 2004–2014
64Inventor score
Top patents by PatentIndex Score
5 records- 0178US7982307B2Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrateAGERE SYSTEMS INC·Filed 2006·Granted Jul 19, 2011·9 cites·20 claims
- 0262US7479695B2Low thermal resistance assembly for flip chip applicationsAGERE SYSTEMS INC·Filed 2006·Granted Jan 20, 2009·3 cites·20 claims
- 0360US7671436B2Electronic packagesAGERE SYSTEMS INC·Filed 2008·Granted Mar 2, 2010·2 cites·21 claims
- 0441US2015243617A1Method for Flip-Chip Bonding Using Copper PillarsLSI CORP·Filed 2014·Application pending·0 cites
- 0534US2005287350A1Encapsulating compound having reduced dielectric constantCROUTHAMEL DAVID L·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →