Inventor · disambiguated record
Dan Custer
Also filed as: CUSTER DAN · CUSTER DAN G
10 granted patents·2 pending applications·178 citations·filing 1997–2018
90Inventor score
Top patents by PatentIndex Score
12 records- 0190USD661085SBackpackCUSTER DAN·Filed 2010·Granted Jun 5, 2012·56 cites·1 claims
- 0280US10398223B2Hanger and storage unitWHITMOR INC·Filed 2018·Granted Sep 3, 2019·3 cites·13 claims
- 0380US6007406APolishing systems, methods of polishing substrates, and method of preparing liquids for semiconductor fabrication processMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 28, 1999·34 cites·5 claims
- 0476US6206757B1Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processesMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 27, 2001·35 cites·23 claims
- 0574USD640054SLuggage roller with docking zipperCUSTER DAN·Filed 2010·Granted Jun 21, 2011·22 cites·1 claims
- 0663US6200196B1Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processesMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 13, 2001·16 cites·10 claims
- 0756USD640051SBag with detachable pouchCUSTER DAN·Filed 2010·Granted Jun 21, 2011·10 cites·1 claims
- 0851US2014290025A1Bag Combination and Three Sided ZipperCUSTER DAN·Filed 2011·Application pending·0 cites
- 0951US2014041976A1Luggage Roller with Out of Seam Docking ZipperCUSTER DAN·Filed 2011·Application pending·0 cites
- 1040US6719823B2Polishing systems, methods of polishing substrates, and methods of cleaning polishing slurry from substrate surfacesMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 13, 2004·0 cites·17 claims
- 1133US6716802B1Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 6, 2004·2 cites·13 claims
- 1230USD837557SHanger and storage unitWHITMOR INC·Filed 2017·Granted Jan 8, 2019·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →