Inventor · disambiguated record
David Danovitch
Also filed as: DANOVITCH DAVID · DANOVITCH DAVID D
13 granted patents·216 citations·filing 2001–2012
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0192US8421217B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2012·Granted Apr 16, 2013·19 cites·19 claims
- 0292US8202765B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2009·Granted Jun 19, 2012·28 cites·22 claims
- 0390US8290008B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2009·Granted Oct 16, 2012·18 cites·12 claims
- 0488US6924171B2Bilayer wafer-level underfillIBM·Filed 2001·Granted Aug 2, 2005·51 cites·22 claims
- 0587US7473618B1Temporary structure to reduce stress and warpage in a flip chip organic packageIBM·Filed 2008·Granted Jan 6, 2009·14 cites·1 claims
- 0686US8559474B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2012·Granted Oct 15, 2013·9 cites·6 claims
- 0783US6819566B1Grounding and thermal dissipation for integrated circuit packagesIBM·Filed 2003·Granted Nov 16, 2004·34 cites·8 claims
- 0875US7820483B2Injection molded soldering process and arrangement for three-dimensional structuresIBM·Filed 2007·Granted Oct 26, 2010·6 cites·6 claims
- 0974US6893799B2Dual-solder flip-chip solder bumpIBM·Filed 2003·Granted May 17, 2005·22 cites·19 claims
- 1073US7952205B2Injection molded soldering process and arrangement for three-dimensional structuresIBM·Filed 2010·Granted May 31, 2011·3 cites·12 claims
- 1170US7538432B1Temporary structure to reduce stress and warpage in a flip chip organic packageIBM·Filed 2008·Granted May 26, 2009·4 cites·1 claims
- 1269US7498198B2Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying propertiesIBM·Filed 2007·Granted Mar 3, 2009·5 cites·7 claims
- 1366US7786588B2Composite interconnect structure using injection molded solder techniqueIBM·Filed 2006·Granted Aug 31, 2010·3 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →