Inventor · disambiguated record
Daniel A. Delibac
Also filed as: DELIBAC DANIEL A
6 granted patents·1 pending application·6 citations·filing 2008–2015
73Inventor score
Top patents by PatentIndex Score
7 records- 0168US9087839B2Semiconductor structures with metal linesIBM·Filed 2013·Granted Jul 21, 2015·2 cites·20 claims
- 0268US8003536B2Electromigration resistant aluminum-based metal interconnect structureIBM·Filed 2009·Granted Aug 23, 2011·2 cites·7 claims
- 0362US9330988B1Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughnessIBM·Filed 2014·Granted May 3, 2016·1 cites·15 claims
- 0459US8084864B2Electromigration resistant aluminum-based metal interconnect structureCHAPPLE-SOKOL JONATHAN D·Filed 2011·Granted Dec 27, 2011·1 cites·13 claims
- 0550US9006703B2Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereofIBM·Filed 2013·Granted Apr 14, 2015·0 cites·12 claims
- 0647US9576863B2Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughnessIBM·Filed 2015·Granted Feb 21, 2017·0 cites·20 claims
- 0745US2009230555A1Tungsten liner for aluminum-based electromigration resistant interconnect structureIBM·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →