Inventor · disambiguated record
Daniel Devoe
Also filed as: DEVOE DANIEL · DEVOE DANIEL F
22 granted patents·1 pending application·995 citations·filing 1992–2009
97Inventor score
Top patents by PatentIndex Score
23 records- 0198US6587327B1Integrated broadband ceramic capacitor arrayFiled 2002·Granted Jul 1, 2003·181 cites·17 claims
- 0297US6816356B2Integrated broadband ceramic capacitor arrayFiled 2003·Granted Nov 9, 2004·103 cites·34 claims
- 0396US6542352B1Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant viasFiled 2001·Granted Apr 1, 2003·81 cites·26 claims
- 0494US7307829B1Integrated broadband ceramic capacitor arrayDEVOE DANIEL·Filed 2005·Granted Dec 11, 2007·36 cites·34 claims
- 0594US6753218B2Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant viasFiled 2003·Granted Jun 22, 2004·53 cites·15 claims
- 0693US7633739B2Stacked multilayer capacitorDEVOE DANIEL·Filed 2008·Granted Dec 15, 2009·27 cites·17 claims
- 0791US6970341B1Integrated broadband ceramic capacitor arrayDEVOE DANIEL·Filed 2004·Granted Nov 29, 2005·54 cites·12 claims
- 0889US7075776B1Integrated broadband ceramic capacitor arrayDEVOE DANIEL·Filed 2005·Granted Jul 11, 2006·19 cites·14 claims
- 0988US6081416ALead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramicFiled 1998·Granted Jun 27, 2000·94 cites·18 claims
- 1087US6545854B2Fringe-field non-overlapping-electrodes discoidal feed-through ceramic filter capacitor with high breakdown voltagePRESIDIO COMPONENTS INC·Filed 2001·Granted Apr 8, 2003·46 cites·35 claims
- 1184US6751082B2Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant viasFiled 2003·Granted Jun 15, 2004·29 cites·18 claims
- 1283US6366443B1Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely-spaced interior conductive planes reliably connecting to positionally-tolerant exterior pads through multiple redundant viasFiled 1997·Granted Apr 2, 2002·54 cites·28 claims
- 1380US6760215B2Capacitor with high voltage breakdown thresholdFiled 2003·Granted Jul 6, 2004·29 cites·29 claims
- 1479US8289675B2Stacked multilayer capacitorDEVOE DANIEL·Filed 2009·Granted Oct 16, 2012·9 cites·22 claims
- 1577US6690558B1Power resistor and method for makingFiled 2002·Granted Feb 10, 2004·11 cites·44 claims
- 1676US6619763B2Feed-through filter capacitor with non-overlapping electrodesPRESIDIO COMPONENTS INC·Filed 2002·Granted Sep 16, 2003·24 cites·49 claims
- 1770US5367430AMonolithic multiple capacitorPRESIDIO COMPONENTS INC·Filed 1992·Granted Nov 22, 1994·45 cites·29 claims
- 1868US7035080B1Combined multilayer and single-layer capacitor for wirebondingDEVOE LAMBERT·Filed 2004·Granted Apr 25, 2006·17 cites·25 claims
- 1963US6917509B1Single layer capacitor with dissimilar metallizationsFiled 2002·Granted Jul 12, 2005·11 cites·25 claims
- 2063US5657199AClose physical mounting of leaded amplifier/receivers to through holes in monolithic, buried-substrate, multiple capacitors simultaneous with electrical connection to dual capacitors otherwise transpiring, particularly for hearing aid filtersFiled 1995·Granted Aug 12, 1997·30 cites·8 claims
- 2160US5625528AMonolithic, buried-substrate, ceramic multiple capacitors isolated, one to the next, by dual-dielectric-constant, three-layer-laminate isolation layersFiled 1995·Granted Apr 29, 1997·26 cites·8 claims
- 2249US5740010APrinting and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitorsFiled 1995·Granted Apr 14, 1998·16 cites·8 claims
- 2347US2008291602A1Stacked multilayer capacitorDEVOE DANIEL·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →