Inventor · disambiguated record
David Frederick Diefenderfer
Also filed as: DIEFENDERFER DAVID FREDERICK
2 granted patents·40 citations·filing 1998–1998
65Inventor score
Technology areasH10W
Files withIBM2
Top patents by PatentIndex Score
2 records- 0163US5888838AMethod and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation informationIBM·Filed 1998·Granted Mar 30, 1999·25 cites·17 claims
- 0251US6171873B1Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation informationIBM·Filed 1998·Granted Jan 9, 2001·15 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →