Inventor · disambiguated record
Daqiao Du
Also filed as: DU DAQIAO
6 granted patents·3 pending applications·8 citations·filing 2017–2024
71Inventor score
Top patents by PatentIndex Score
9 records- 0187US10617000B2Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boardsINTEL CORP·Filed 2017·Granted Apr 7, 2020·5 cites·26 claims
- 0276US10157822B1Heterogeneous interconnect having linear and non-linear conductive pathwaysINTEL CORP·Filed 2017·Granted Dec 18, 2018·3 cites·19 claims
- 0374US2025093413A1Near field wireless communication system for mother to package and package to package sideband digital communicationINTEL CORP·Filed 2024·Application pending·0 cites
- 0461US12196807B2Near field wireless communication system for mother to package and package to package sideband digital communicationINTEL CORP·Filed 2020·Granted Jan 14, 2025·0 cites·18 claims
- 0556US12266878B2Electrical interconnect with improved impedanceINTEL CORP·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 0648US10950536B2Packed interconnect structure with reduced cross coupled noiseINTEL CORP·Filed 2018·Granted Mar 16, 2021·0 cites·14 claims
- 0748US2022244291A1Shielded fine-pitch high-performance impedance tunable interconnectFRANCO ISMAEL·Filed 2022·Application pending·0 cites
- 0844US2022338344A1Phase heterogeneous interconnects for crosstalk reductionINTEL CORP·Filed 2022·Application pending·0 cites
- 0943US10074919B1Board integrated interconnectINTEL CORP·Filed 2017·Granted Sep 11, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →