Inventor · disambiguated record
Daniel Dunker
Also filed as: DUNKER DANIEL
8 granted patents·2 pending applications·1 citations·filing 2016–2023
72Inventor score
Top patents by PatentIndex Score
10 records- 0155US10645814B2Method for creating patterned coatings on a molded article, and device for carrying out said methodPlasma Innovations GmbH·Filed 2016·Granted May 5, 2020·1 cites·5 claims
- 0254US11072041B2Method for producing a technical maskLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Jul 27, 2021·0 cites·21 claims
- 0354US2023405726A1Substrate carrier made of glass for processing a substrate and a method for manufacture of the substrate carrierLPKF LASER & ELECTRONICS SE·Filed 2023·Application pending·0 cites
- 0452US11065716B2Method for processing, in particular separating, a substrate by means of laser-induced deep reactive etchingLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Jul 20, 2021·0 cites·12 claims
- 0551US11156774B2Optical component and method for the production thereofLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Oct 26, 2021·0 cites·22 claims
- 0648US11478880B2Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching processLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Oct 25, 2022·0 cites·9 claims
- 0747US12398066B2Method for producing a display having a carrier substrate, a carrier substrate produced according to said method, and a cover glass intended for a flexible displayLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Aug 26, 2025·0 cites·15 claims
- 0846US11851366B2Site-specific connecting of glass substratesLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Dec 26, 2023·0 cites·14 claims
- 0945US2023192535A1Method for introducing a recess into a substrateLPKF LASER & ELECTRONICS AG·Filed 2021·Application pending·0 cites
- 1043US12421167B2Substrate made of glass and method for the production thereofLPKF LASER & ELECTRONICS SE·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →